BIWIN TF200 Series MicroSD: Enhanced Raspberry Pi 4B Compatibility
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BIWIN TF200 Series MicroSD: Enhanced Raspberry Pi 4B Compatibility

　　BIWIN's TF200 series microSD cards have passed the Raspberry Pi 4B AVL certification, ensuring compatibility and adaptability with Raspberry Pi microcomputers.　　The TF200 microSD cards underwent rigorous tests on the Raspberry Pi 4 Model B/4GB platform. These tests included loading each test card with a custom image (including the latest Bullseye image), an automated stress test script, and a locally accessible website using Google Puppeteer for automated testing. After over 15,000 power-off tests and over 2.7 million seconds of continuous operation, the product demonstrated a continuous write speed of over 26 MB/s, a random write speed of up to 717 IOPS, and a random read speed of up to 3525 IOPS. These results meet the testing benchmarks required by Raspberry Pi, ensuring efficient and stable operation of the Raspberry Pi devices.　　The TF200 series microSD cards feature firmware functionalities such as garbage collection and bad block management to ensure stable data recording without frame loss. The product reaches the U3 speed class and V30 video speed class, with sequential read and write speeds of up to 158 MB/s and 113 MB/s respectively, supporting 4K RAW ultra-high-definition video capture and high-speed continuous shooting. Leveraging the company's advanced packaging technologies like multi-layer stacking and ultra-thin Die, the product offers capacities up to 256 GB (with future releases of 512 GB and 1 TB). It also supports flash wear leveling technology with a P/E Cycle of 3000 times. With operational temperature ranges from -25 °C to 85 °C and features such as waterproofing, shock resistance, and temperature shock resistance, the product is well-equipped to handle various complex environmental challenges.　　The TF200 series microSD cards combine high stability, reliability, and durability, making them compatible with mainstream terminal devices. They are suitable for fields like video surveillance, digital education, industrial tablets, and dashcams. Leveraging its expertise in storage solution development and advanced testing, BIWIN can tailor storage device performance, reliability, and power consumption to meet the testing and certification requirements of SoC chips and system platforms. This adaptability ensures a high degree of compatibility with different platforms, effectively meeting the diverse storage needs of various terminal applications.
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Release time：2024-01-26 13:44 reading：2132 Continue reading>>
Global Handset <span style='color:red'>ASP</span> Increase Limits 3Q 2022 Revenue Decline to 3% YoY
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Global Handset ASP Increase Limits 3Q 2022 Revenue Decline to 3% YoY

　　The record shipment contribution (46%) of 5G handsets, which cost five times an average non-5G handset, added to the global smartphone ASP and revenue growth.　　The global smartphone handset market’s revenue declined by 3% year-on-year (YoY) in the third quarter (3Q 2022) to just above $100 billion, according to the latest research from Counterpoint Technology Market Research’s Market Monitor Service. A 10% YoY growth was seen in the average selling price (ASP) thanks to the premium handset segment’s greater resilience to economic uncertainty.　　The record shipment contribution (46%) of 5G handsets, which cost five times an average non-5G handset, also added to the ASP and revenue growth. In terms of shipments, the overall handset market saw a 12% YoY decline during the quarter.　　“At over $80 billion, the revenue contribution of 5G handsets reached an all-time high of 80% of global handset revenues, up from 69% in the third quarter of last year. In the same period, LTE handsets’ revenue contribution fell 10% to $19 billion. This shift from 4G to 5G has been led by Apple, which alone makes up for over half of all 5G revenues as over 95% of its phones are 5G-enabled. Apple saw a 10% YoY revenue growth and 7% YoY ASP growth in Q3 2022, contributing to an overall increase in global handset ASP. This is thanks in part to the launch of the iPhone 14 series as well as the Pro models, especially from the previous generation, doing well,” Senior Analyst Harmeet Singh Walia said.　　Samsung, the second biggest handset OEM in terms of revenue, saw a relatively modest ASP increase of 2% YoY in Q3 2022 despite an almost doubling of the shipments of its premium Flip and Fold series in the same period as well as a 27% YoY revenue growth of its 5G smartphones. The lower growth of its ASP can be attributed to a shift in its focus from the more successful S22 series to the still upcoming foldable series. Consequently, Samsung’s revenue declined 4% YoY in Q3 2022.　　Xiaomi’s handset revenue grew 4% YoY, a significant portion of which came from the low-to-mid price bands. The shipment share of the over-$300 price band declined by close to 1.5%. There was, however, a significant shift from the sub-$200 to $200-$299 price band. Consequently, Xiaomi’s ASP grew 14% YoY to $205.　　OPPO, on the other hand, saw an ASP as well as a revenue decline of 5% and 27% YoY respectively. The revenue decline was primarily caused by OPPO’s shipment decline in COVID-hit China, which contributed over 40% to its total shipments in Q3 2022. Given that China contributed over half of vivo’s total shipments, its revenue took an even bigger hit of 43% YoY despite growing 4% QoQ.
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Release time：2022-12-30 16:33 reading：2505 Continue reading>>
SEMI China, C<span style='color:red'>ASP</span>A promote China-Silicon Valley innovation partnership
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SEMI China, CASPA promote China-Silicon Valley innovation partnership

Aiming to forge stronger ties between the two technology heavyweights as partners in semiconductor industry innovation, SEMI and CASPA (Chinese American Semiconductor Professional Association) in mid July signed a strategic cooperation agreement to promote industry innovation between Silicon Valley and China. Under the agreement, SEMI and CASPA will work to connect Silicon Valley and China industry resources and encourage greater collaboration.The agreement, signed at the “SIIP China Innovation and Investment Forum: Innovation at Scale: from IoT, Cloud to AI & ADAS” in Silicon Valley, supports key SEMI principles including free trade, open markets, intellectual property protection, global cooperation and innovation, said SEMI China president Lung Chu.Brandon Wang, president and chairman of CASPA, and Lung Chu, SEMI China president, sign strategic cooperation agreement.Speaking at the event attended by more 200 industry executives and visionaries, Chu noted that with 2019 expected to be another record year for fab and equipment investment and the semiconductor on track to reach $500 billion by next year, the time is ripe for greater cooperation between Silicon Valley and China. China and South Korea (Samsung) are driving sharp growth in global semiconductor equipment sales.The global artificial intelligence (AI) industry is taking shape with companies ranging from startups and multinationals to semiconductor and Internet providers investing in AI research and development as China and the United States make the heaviest AI investments of all regions. A plethora of AI applications enabled by 5G will spur even greater IC demand.Opening the event, SEMI president and CEO Ajit Manocha noted that technologies such as AI, Internet of Things (IoT) will transform our lives and that semiconductor industry leaders must cultivate a new generation of innovators to ensure continued industry growth.Mark Ding, CEO of Shanghai Industrial Technology Research Institute (SITRI), said China is well-positioned to help goose semiconductor industry growth with its ample capital, lower capital expenditures and strong local market. He also noted that three keys to innovation are platforms, talent and capital.Dr. Naveed Shervani, CEO of SiFive, the first fabless semiconductor company to build customized silicon based on the free and open RISC-V instruction set architecture, proposed goals for future semiconductor industry growth including reducing IC and IP costs and cutting design time.Stuart Ching, VP of KULR Technology, a provider of thermal management technologies, pointed to the importance of lithium batteries. Those with higher energy density and lower cost would promote a range of power applications for mobile electronic equipment and lead to the mass production of solid-state batteries between 2023 and 2025.
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Release time：2018-08-09 00:00 reading：1009 Continue reading>>
The Global Sales Revenue of DRAM Modules for 2017 Recorded a Significant Growth of 69% Thanks to Rising <span style='color:red'>ASP</span>
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The Global Sales Revenue of DRAM Modules for 2017 Recorded a Significant Growth of 69% Thanks to Rising ASP

DRAMeXchange, a division of TrendForce, reports that the global sales revenue of DRAM modules for 2017 totaled US$11.7 billion, amounting to a significant growth of 69% compared with the result of the previous year. The high revenue is due to the nearly 50% YoY growth of DRAM ASP, although the contribution of the spot market to the total DRAM revenue is getting smaller.Due to difficulties in process migration, oligopolistic market, and lack of new production capacity, DRAM products have seen a considerable price rise in 2017, with specialty DRAM recording the highest growth. Despite the decreasing contribution to total DRAM revenue, spot market appeared to be more price-sensitive, and suffered stronger price fluctuations when DRAM was in undersupply. For the whole year of 2017, the ASP in the spot market increased by over 60% and greatly contributed to the revenue of module makers.Kingston topped the 2017 sales revenue ranking; ADATA ranked 2nd thanks to its low-price DRAM inventory at a high levelA few large module makers continued to dominate the market in 2017 and were more secure in their positions. The first top five module houses in the top 10 ranking took 85% of the global revenue market share. They together with the last five module houses in the top 10 ranking accounted for 93% of the year’s total revenue.Kingston again held on to first place because the company benefitted from its increased DRAM shipments and higher prices. The company’s DRAM sales revenue grew by almost 60% YoY in 2017 to another record high. However, Kingston witnessed less growth momentum than other small- and medium-sized module makers due to its high base and its focus on DDR3 products. Kingston offers mainly DDR3, which benefits less from the rising ASP compared with mainstream DDR4 products. Despite this, Kingston still topped the 2017 sales revenue ranking.Amid undersupply of DRAM, ADATA’s annual sales revenue increased significantly by 146%, thanks to its low-price DRAM inventory at a high level. With flexible sales capabilities, ADATA managed to take second place in the year’s global ranking, surpassing Smart Modular Technologies and Ramaxel.Transcend Information continued to develop industrial DRAM modules; Team Group had made inroads into the gaming marketIn terms of Taiwan-based suppliers, Transcend Information ranked 7th in 2017 and 6th in 2016, with a more conservative sales revenue growth in the past three years. The company has been shifting from the highly volatile and risky spot market to more stable industrial products. Consequently, Transcend Information has managed to increase its profitability thanks to the stable industrial DRAM market and higher profit margin than its original business in the spot market.Apacer Technology has been always relatively conservative in procurement, thus has been less benefited from the low-price inventory. On the other hand, the company has focused on the industrial DRAM sector for many years and developed related products lines. Meanwhile, it also made inroads into markets of industrial IoT and gaming products. With a stable level of profitability, Apacer Technology has also decreased the risks brought by fluctuations in the memory industry.Team Group has demonstrated a strong ambition to differentiate from other module makers. After years of hard work, Team Group has launched a series of gaming products with very positive feedbacks. Particularly, the speed of its gaming DRAM modules has reached an industry-leading 4500Mhz. Gaming DRAM modules accounted for more than 50% of the sales revenue of Team Group. This percentage was much higher than that of general module makers, resulting in almost double DRAM sales revenue for the company in 2017.
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Release time：2018-07-31 00:00 reading：1031 Continue reading>>
Smartphone Displays Set to Move Rapidly to 18:9 and Wider Aspect Ratios in Second Half of 2018
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Smartphone Displays Set to Move Rapidly to 18:9 and Wider Aspect Ratios in Second Half of 2018

With every smartphone brand applying the 18:9 and wider aspect ratio screens to its newer models, the rate of adoption is expected to quicken in the second half of 2018. Smartphones using 18:9 and wider aspect screens are forecast to increase to 66 percent of total smartphone shipments in the third quarter of 2018, soaring up from 10 percent in the same period last year, according to business information provider IHS Markit (Nasdaq: INFO). After Samsung Electronics and Apple released their phones last year with new wider aspect ratios of 18.5:9 and 19.5:9, respectively, most smartphone brands have similarly followed suit by applying wider aspect screens to their 2018 lineup to keep up with product differentiation.Improvements in display technologies have hastened the expansion of the wider screen adoption in smartphones. Initially, flexible active-matrix organic light-emitting diode (AMOLED) technology was required to realize a full-screen display, and thus, 18:9 or wider screens were expected predominantly to be used in premium and high-end smartphones in 2018. However, with rapidly improving designs in liquid crystal display (LCD) cell structure, thin-film transistor (TFT) array and light-emitting diode (LED) backlight, TFT LCD can now be used in full-screen smartphones.“With the improvement in TFT LCD technology, smartphone makers are now aggressively applying 18:9 aspect ratio of TFT LCD to their 2018 models even for mid-end and entry-level smartphones, instead of using high-priced flexible AMOLED panels,” said Hiroshi Hayase, senior director at IHS Markit.“It would be correct to assume that smartphone displays are undergoing a quick generation change to TFT LCD-based full screens later this year,” Hayase said. “The new generation of smartphones will be expected to stimulate replacement demand in the 2019 smartphone market.”
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Release time：2018-07-17 00:00 reading：1315 Continue reading>>
Global DRAM Revenue Expects New High in 3Q18 as Peak Season Brings Marginal <span style='color:red'>ASP</span> Rise
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Global DRAM Revenue Expects New High in 3Q18 as Peak Season Brings Marginal ASP Rise

Since the end of 2Q18, major DRAM suppliers have been negotiating over the contract prices for Q3. Despite the fact that the bit output has been increasing quarter by quarter, the average selling prices of DRAM may still see a marginal rise in 3Q18 since the buyers are eager to stock up for the upcoming traditional peak season, says DRAMeXchange, a division of TrendForce.“As suppliers migrate to 1X or 1Y nm process one after another, the DRAM bit output increased by 3.2% in 2Q18 QoQ although some issues remain regarding the yield rate and product quality”, says Avril Wu, senior research director of DRAMeXchange. On the demand front, the market will witness steady stock up demand as the safety stock levels have not been reached, resulting in the marginal rise in DRAM ASP QoQ.Going forward to Q3 of the year, the share of 1X or 1Y nm process will continue to increase, and DRAMeXchange estimates the bit output growth at 4.8% in 3Q18. Driven by the peak season, DRAM ASP will see a marginal rise, resulting in a new high of global DRAM revenue in 3Q18.Mainstream demand comes from high-end smartphones and data centers; graphics DRAM products to see slashed demandFrom the perspective of applications, the DRAM price rise in Q3 is attributed to demand for server DRAM and mobile DRAM. DRAMeXchange points out that the demand for server DRAM will see steady growth in Q3, so the prices of mainstream server modules to be shipped to the first-tier firms may advance by 1-2% in Q3. Meanwhile, the price rise will be limited thanks to increased shipment fulfillment rates since Q1. Consequently, the quotes offered by first-tier and second-tier firms for Q3 contract prices will not be much different.As for mobile DRAM, increasing adoption of high-density LPDDR4 in high-end Android smartphones has contributed to the ASP rise. The DRAM capacity of newly released smartphones has been improved to 6GB or even 8GB, leading to the tighter supply of both discrete LPDDR4 products and eMCP LPDDR4 products. In this situation, DRAMeXchange expects that the prices of mobile DRAM may increase by 1-2% in 3Q18.On the other hand, previous growth momentum for graphics DRAM and consumer DRAM products may disappear completely due to declined demand for cryptocurrency mining. Particularly, after significant price rise in 1H18, graphics DRAM may see price decline in the second half.DRAM prices may continue to grow in 2H18, yet the growth will be moderatedOverall speaking, the bit output growth brought by migration to 10 nm process is not as much as that in previous generations of technology process migration. However, as the suppliers adopt the new process successively, the bit output will still see continuous growth in the next few quarters. For the rest of year, DRAMeXchange notes that the price growth has been increasingly marginal despite the stable demand in the peak season. Consequently, DRAMeXchange expects that the price growth may be even flat in 4Q18.
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Release time：2018-07-03 00:00 reading：1021 Continue reading>>
DRAM Revenue in 1Q18 Rose by 5.4% QoQ to Another Record High as the Upswing of <span style='color:red'>ASP</span>s Continued
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DRAM Revenue in 1Q18 Rose by 5.4% QoQ to Another Record High as the Upswing of ASPs Continued

DRAMeXchange, a division of TrendForce, reports that the global DRAM revenue for 1Q18 rose by 5.4% QoQ to a new record high. Prices of graphics DRAM products rose significantly by 15% QoQ in 1Q18, given the relatively low base and the surge of demand from the cryptocurrency mining market. Prices of DRAM products for other application markets also increased by 3-6% QoQ.According to Avril Wu, senior research director of DRAMeXchange, most PC-OEMs have concluded negotiating their procurement contracts for 2Q18. The average quote of mainstream PC DRAM modules from the first-tier DRAM suppliers came to US$34 this April, showing a 3% increase from the average price in 1Q18. From the perspective of the market, DRAM suppliers have kept a greater share of their capacity for server memory products, which are generally seeing greater demand, higher gross margins, and higher profitability. Furthermore, first-tier DRAM suppliers will gradually start using their expanded capacity later, toward the end of 2018. Hence, prices of PC DRAM products will stay on an uptrend in 2Q18.Revenue-wise, Samsung was firmly the leader in the industry, with a new record high set. Specifically, Samsung’s 1Q18 revenue rose by 2.9% QoQ to US$10.36 billion. SK Hynix’s revenue from the same period also advanced by 2.2% QoQ to US$6.43 billion. Product shipments from the top two South Korean suppliers slipped a bit in 1Q18 because of the weak smartphone market. Consequently, their combined global market share in revenue terms also decreased slightly from the prior quarter to around 73% in 1Q18. Respectively, Samsung’s market share came to 44.9%, while SK Hynix’s was 27.9%.Micron remained third place in the revenue ranking but has been the price leader so far in 1H18 as the company is keen on raising quotes. Compared with Samsung and SK Hynix, Micron’s price hikes were noticeably larger in 1Q18, surpassing 10% QoQ on average. As a result, Micron’s 1Q18 revenue reached US$5.21 billion, up by 14.3% QoQ. Micron also expanded its market share by two percentage points from the prior quarter to 22.6%.Regarding the operating margins of the top three suppliers, Samsung again broke its previous record in 1Q18. Samsung’s operating margin grew significantly from 64% in 4Q17 to 69% in 1Q18. SK Hynix, too, expanded its operating margin from 59% in 4Q17 to 61% in 1Q18. Both the top two South Korean suppliers have pushed their respective operating margins over the 60% level. Micron’s operating margin in 1Q18 came to 58%, which was also a marked increase from the 53% of 4Q17. Going forward, the general price increase and the cost improvements in connection with technological advances are expected to keep driving profit for the top three suppliers and take their operating margins to new highs in 2Q18. However, the profitability of the top suppliers is also far exceeding the buyers’ acceptable limit. For example, Samsung’s operating margin in 1Q18 translates to a gross margin surpassing 80%. This implies that the hikes in quotes will likely start to moderate.With respect to the technological development, Samsung is consistent with its objective of maintaining its 18nm output share at 50-60%. The DRAM line on the second floor of Samsung’s Pyeongtaek plant is being readied for production and will represent the company’s transition to its next-generation 16nm process. SK Hynix is currently focus on raising the yield rate of its 18nm process that entered production at the end of last year. Nevertheless, the supplier is finding that the transition to the next-generation 1X nm processing is more difficult than anticipated. SK Hynix is sticking to the same capacity expansion plan, so its second fab in Wuxi is on track to finish construction at the end of 2018 and will be in operation in 1H19 at the earliest. As for Micron, its subsidiary Micron Memory Taiwan (formerly Rexchip) is now totally producing on the 17nm process. The other subsidiary Micron Technology Taiwan (formerly Inotera) has begun the migration from the 20nm to the 17nm in 2Q18 and will gradually ramp up the 17nm production in 2H18.The latest survey of Taiwan-based suppliers finds that Nanya saw a substantial increase in its DRAM revenue in 1Q18, up by 15.1% QoQ. Nanya’s strong performance was mainly attributed to the bit supply growth and cost reduction resulting from the migration to the 20nm process, which contributed to an increase of five percentage points in operating margin from the prior quarter to 44.3% in 1Q18. Nanya’s profit will keep going up as the company improves the yield rate of its 20nm process and optimizes its product mix.Powerchip’s 1Q18 DRAM revenue rose by 8.2% QoQ as the company has also raised its quotes. Additionally, Powerchip continues to see growth in its foundry business that serves IC design houses such as ESMT and AP Memory. Winbond’s DRAM revenue rose slightly in 1Q18 by just 1.2% QoQ. Winbond registered flat growth because the price hikes of its specialty DRAM products were relatively small.
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Release time：2018-05-15 00:00 reading：1069 Continue reading>>
UK maker community turns to Raspberry Pi
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UK maker community turns to Raspberry Pi

The Raspberry Pi is becoming more popular with UK makers as nearly half of Brits (48 per cent) say they plan to use it for an electronics project, with 87 per cent of makers having already used the mini-PC to make a smart home device.Research conducted by online retailer reichelt found that there was a clear upward trend towards home-made smart technology as the use of these devices become increasingly popular for day to day life.The expanding capabilities of mini-PCs like Raspberry Pi are a key factor behind this rise in popularity, with 24 per cent of those questioned saying that they were planning to make their own smart home device, such as smart lighting, thermostats or alarms, using a Raspberry Pi board.The most popular smart gadgets were found to be security alarms – 26 per cent have made their own versions, followed by smart lighting or heating (24 per cent).Nearly half (48 per cent) of those surveyed said they plan to use the Raspberry Pi for an electronics project in the future.According to reichelt‘s research, the Raspberry Pi is proving so popular because of its:Easy installation – 20 per centLow price point – 13 per centSmall format – 11 per centInternet capability – 11 per centWhen it came to future updates and new releases, more than half of those surveyed want even more memory (54%) and even more computing power (53%) for the next Raspberry Pi model.Top Raspberry Pi projectsRaspberry Pi’s are most commonly used for:Computer for every day use – 31 per centPrinter – 29 per centMultimedia centre – 22 per centGaming – 22 per centMulti-room audio – 18 per centRemote control for devices – 18 per centWhilst there is an upward trend for more maker projects, the UK is significantly behind Germany with Germans using Raspberry Pi nearly twice as much as – 47 per cent vs one fifth.According to Sven Pannewitz, product manager for Active/Passive Components at reichelt, the affordability and versatility of the Raspberry Pi is the key driver behind this trend."The Maker projects are definitely showing a positive market development and we are seeing more developer boards being used. The projects are getting smarter, especially when it comes to home automation, because the Raspberry Pi can be used so effectively in a variety of ways.“The WiFi connection, which has been integrated since version 3, and the new PoE capability in the new 3B+ model, make the Raspberry Pi particularly interesting for smart home projects. The trend for future projects points primarily to lighting and heating control in the smart home, but the Raspberry Pi is also frequently being used as a multimedia centre."
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Release time：2018-04-25 00:00 reading：3247 Continue reading>>
New Raspberry Pi Improves Processing, Connectivity
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New Raspberry Pi Improves Processing, Connectivity

　　The Raspberry Pi Foundation launched the latest version of its module featuring significant improvements in performance, wireless connectivity and wireless circuitry certification to enable users to reduce the cost of conformance testing.　　The new Raspberry Pi 3 Model B+, which maintains the $35 price tag of the previous model, features a 1.4GHz 64-bit quad-core ARM Cortex-A53 CPU, dual-band 802.11ac wireless LAN and Bluetooth 4.2, faster Ethernet (Gigabit Ethernet over USB 2.0), power-over-Ethernet support (with separate PoE HAT) and improved thermal management. Alongside a 200MHz increase in peak CPU clock frequency, the company says the new module has roughly three times the wired and wireless network throughput, and the ability to sustain high performance for much longer periods.　　One of the key features of the module is the radio certification. The wireless circuitry is encapsulated under a metal shield, which has allowed the company to certify the entire board as a radio module under FCC rules, which in turn will significantly reduce the cost of conformance testing Raspberry Pi-based products.　　This is significant, especially for the company’s commercial base, according to Eben Upton, co-founder of the Raspberry Pi Foundation, speaking to EE Times. The company may have started out with a mission to bring more people into electronics design and computer programming, but the module is also a commercial success in mainstream products.　　“We've seen a lot of people designing Raspberry Pi into their own products, and this has become an important part of our commercial business, which of course funds our charitable work," Upton said. "Many of the features we've incorporated into 3+, particularly the modular certification and thermal improvements, have been driven by feedback from the design community.”　　The implication of this is that if customers build the new module into a product, compliance of the Wi-Fi and radio part is already covered, so the cost and time required for achieving conformance is reduced.　　Upton also said that next generation of products will be driven more by what designers are looking for. “While we have a policy of not discussing future products, with Raspberry Pi 3B+ out of the way we'll be turning our attention to what we do next," he said. "We'll be speaking to the design community about what they'd like to see in a next-gen Raspberry Pi, but I'd be surprised to see any significant change in the feature mix: it's likely to be "more" of everything we have today.”　　Asked about the global market for the Raspberry Pi, Upton responded, “Our largest market is North America, followed by the UK and Germany. We're seeing some larger companies designing it in now, alongside smaller entrepreneurial companies and individuals, which remain an important part of our strategy.”　　Upton cited examples from last year such as NEC, which introduced intelligent large format displays with Raspberry Pi connectivity, and NComputing, which introduced a cloud-ready, dual-screen capable and Wi-Fi ready thin client for Windows and Linux, built on the Raspberry Pi 3.　　The new product is built around BCM2837B0, an updated version of the 64-bit Broadcom application processor used in Raspberry Pi 3B, which incorporates power integrity optimizations, and a heat spreader. Together these enable higher clock frequencies (or to run at lower voltages to reduce power consumption), and to more accurately monitor and control the temperature of the chip.　　Dual-band wireless LAN and Bluetooth are provided by the Cypress CYW43455 combo chip, connected to a Proant PCB antenna similar to the one used on Raspberry Pi Zero W. Compared to its predecessor, Raspberry Pi 3B+ delivers somewhat better performance in the 2.4GHz band, and far better performance in the 5GHz band.　　Previous Raspberry Pi devices have used the LAN951x family of chips, which combine a USB hub and 10/100 Ethernet controller. For Raspberry Pi 3B+, Microchip provided an upgraded version, LAN7515, which supports Gigabit Ethernet. While the USB 2.0 connection to the application processor limits the available bandwidth, the module still sees roughly a threefold increase in throughput compared to Raspberry Pi 3B.　　The module uses a magjack that supports Power over Ethernet (PoE), and bring the relevant signals to a new 4-pin header. A PoE HAT will also be launched soon which can generate the 5V necessary to power the Raspberry Pi from the 48V PoE supply.　　The improved power integrity of the BCM2837B0 package, and the improved regulation accuracy of its new MaxLinear MxL7704 power management IC, has allowed the company to tune clocking and voltage rules for both better peak performance and longer-duration sustained performance.　　Below 70°C, these improvements increase the core frequency to 1.4GHz. Above 70°C, it drops to 1.2GHz, and the improvements are used to decrease the core voltage, increasing the period of time before it reaches a 80°C thermal throttle; the reduction in power consumption is such that many use cases will never reach the throttle. The company says that, like a modern smartphone, it treats the thermal mass of the device as a resource, to be spent carefully with the goal of optimizing user experience.　　The company also highlights that the Raspberry Pi 3B+ does consume substantially more power than its predecessor, so it strongly encourages designers to use a high-quality 2.5A power supply.
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Release time：2018-03-20 00:00 reading：3102 Continue reading>>
Farnell element14 launches GraspIO Cloudio
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Farnell element14 launches GraspIO Cloudio

　　Farnell element14 has launched the GraspIO Cloudio - a Raspberry Pi add-on board with a Drag and Drop programming interface on iPhone, iPad, Android.　　Other features include: Voice Assistant Capabilities, IFTTT (“If This Then That”) Integration, IoT Cloud Service, Sensor Monitor and Dashboard, Custom Notifications with Image and Video and One Tap Multi-Board Upload.　　“The GraspIO Cloudio, when combined with a Raspberry Pi, is a Full Stack IoT platform meaning that you can programme IoT devices simply and quickly with drag and drop programming on a mobile app,” explained Steve Carr, Global Head of Marketing at Premier Farnell and Farnell element14.　　“The combination of built-in hardware facilities and access to application software will make Cloudio a valuable addition to the range of tools available to developers of projects involving voice, motion, imaging and cloud interaction.”　　Cloudio unlocks physical computing applications with Raspberry Pi through a number of features that include: a 0.96-inch OLED display, IR sensor, light sensor, temperature sensor, tactile switch, three ADC ports, a mini servomotor port for external sensors, three digital output ports, an RGB LED, and a buzzer.　　Potential applications for the Cloudio include: voice control, users can create their own voice assistants using the inbuilt speech recognition feature to control Cloudio from a smartphone; speech output in which projects can be made to “talk” with the easy-to-use in-application “Speak” block and the Raspberry Pi’s own headphone jack and, using Cloudio’s on-board or external sensors, it can be deployed as an edge device to design intelligent and responsive sensor monitoring projects. Real-time sensor graphs can be viewed on a mobile device and data can be exported for IoT analytics.
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Release time：2018-02-14 00:00 reading：1123 Continue reading>>

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