
华为定于8月27日召开 “AI SSD,加速智能经济涌现” 新品发布会,剑指 AI 存储器赛道,计划以技术创新推出大容量 AI SSD,突破传统 HBM 的容量限制。
当前 “Token” 智能经济崛起,AI 训练效率、推理体验及成本成核心竞争力。传统 HBM 受容量制约,难满足 AI 大模型等场景需求,华为此款新品将聚焦解决效率与成本痛点,升级 AI 业务存储体验,推动智能经济从 “概念” 落地、“单点突破” 迈向 “全面涌现”。
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| model | brand | Quote |
|---|---|---|
| BD71847AMWV-E2 | ROHM Semiconductor | |
| RB751G-40T2R | ROHM Semiconductor | |
| MC33074DR2G | onsemi | |
| TL431ACLPR | Texas Instruments | |
| CDZVT2R20B | ROHM Semiconductor |
| model | brand | To snap up |
|---|---|---|
| BU33JA2MNVX-CTL | ROHM Semiconductor | |
| IPZ40N04S5L4R8ATMA1 | Infineon Technologies | |
| ESR03EZPJ151 | ROHM Semiconductor | |
| TPS63050YFFR | Texas Instruments | |
| BP3621 | ROHM Semiconductor | |
| STM32F429IGT6 | STMicroelectronics |
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