Introduction to PCB Manufacturing Machines : Types

Release time：2025-03-21
author：AMEYA360
source：网络
reading：197

　　In the ever-evolving world of electronics, Printed Circuit Boards (PCBs) are the unsung heroes that form the backbone of most electronic devices. From smartphones to industrial machinery, PCBs provide the essential connections between various components, ensuring that signals are transmitted effectively and reliably. As demand for electronic devices continues to surge, the need for efficient, high-quality PCB manufacturing has never been greater. This is where PCB manufacturing machines come into play.

Introduction to PCB Manufacturing Machines : Types

　　These machines are pivotal in the production process, transforming raw materials into complex circuit boards that meet stringent specifications. In this introduction, we will explore the different types of PCB manufacturing machines and highlight some of the key players in the industry.

　　Types of PCB Manufacturing Machines

　　1. PCB Fabrication MachinesPCB fabrication is the process of creating the physical circuit board from a design. This involves several key steps, each facilitated by specific types of machines:

　　– Photoplotters: These are used to create photomasks for PCB production. A photomask is a plate with patterns that will be transferred onto the PCB’s surface. Photoplotters use high-precision imaging technology to ensure accurate pattern reproduction.

　　– Drilling Machines: Once the PCB pattern is applied, drilling machines create holes for components and vias. These machines are equipped with high-speed spindles and precision control systems to ensure that holes are drilled accurately and efficiently.

　　– Etching Machines: After drilling, the PCB is subjected to an etching process to remove unwanted copper and leave behind the circuit pattern. Etching machines use chemical solutions or abrasive materials to strip away excess copper while preserving the desired circuitry.

　　– Laminators: Laminating machines are used to bond multiple layers of PCBs together. This process involves applying heat and pressure to laminate the layers into a single, multi-layer board. Laminators ensure that the layers are aligned correctly and that the adhesive bonds are strong.

　　– Solder Mask and Silkscreen Printers: Solder masks are applied to prevent solder from bridging between circuit paths, while silkscreen printers add labels and markings to the PCB. These machines use advanced printing technologies to apply precise coatings and markings.

　　2. PCB Assembly MachinesOnce the PCB is fabricated, it needs to be assembled with electronic components. This step involves several specialized machines:

　　– Pick and Place Machines: These are crucial for the assembly process. Pick and place machines automatically position and place components onto the PCB. They use high-speed cameras and advanced algorithms to ensure components are placed accurately and efficiently.

　　– Soldering Machines: There are various types of soldering machines used in PCB assembly. Wave soldering machines apply solder to the entire PCB at once, while reflow soldering machines use heat to melt solder paste and create precise solder joints. Selective soldering machines target specific areas for soldering, reducing the risk of damage to sensitive components.

　　– Inspection Machines: Quality control is essential in PCB manufacturing. Automated Optical Inspection (AOI) machines use cameras and image processing to detect defects such as soldering errors, missing components, or alignment issues. X-ray inspection machines can inspect internal layers and connections that are not visible externally.

　　3. PCB Testing MachinesTesting is a crucial step to ensure the functionality and reliability of the PCBs. Testing machines include:

　　– In-Circuit Testers (ICT): These machines test the electrical connections and functionality of the PCB by probing each point and checking for continuity, shorts, and other electrical faults.

　　– Functional Testers: Functional testers simulate the PCB’s operating environment to ensure that it performs as expected. These testers are used to evaluate the board’s overall functionality and identify any operational issues.

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Difference between Diode and Triode in PCBA manufacturing
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Difference between Diode and Triode in PCBA manufacturing

　　In printed circuit board assembly (PCBA) manufacturing, understanding the differences between diode and triode is crucial for designing efficient electronic circuits. Both components play essential roles in controlling the flow of electrical current, but they have distinct characteristics that determine their specific applications and functionalities.　　Diode:Diode　　A diode is a two-terminal electronic component that primarily allows current to flow in one direction while blocking it in the opposite direction. Here are key characteristics and uses of diodes in PCBA manufacturing:　　1. Functionality: Diodes are used for rectification, converting AC (Alternating Current) to DC (Direct Current). They ensure that current flows in only one direction, preventing reverse polarity which can damage sensitive components.　　2. Types: Common types include:　　– Rectifier Diodes: Used in power supplies to convert AC to DC.　　– Zener Diodes: Maintain a constant voltage for regulation.　　– Light-Emitting Diodes (LEDs): Emit light when current flows through them, used for indicators and displays.　　3. Applications: Diodes are found in almost all electronic circuits:　　– Power supplies　　– Signal demodulation　　– Overvoltage protection　　– Voltage regulation　　Triode (Transistor):Triode　　A triode, also known as a transistor, is a three-terminal semiconductor device that amplifies or switches electronic signals and electrical power. Here are the key characteristics and uses of triodes in PCBA manufacturing:　　1. Functionality: Triodes can amplify current, acting as switches or amplifiers depending on the configuration:　　– Bipolar Junction Transistors (BJTs): Amplify current and are used for analog circuits.　　– Field-Effect Transistors (FETs): Control current flow with an electric field, used in digital circuits.　　2. Types: Different types cater to specific applications:　　– NPN and PNP BJTs: Common bipolar transistor types.　　– MOSFETs (Metal-Oxide-Semiconductor Field-Effect Transistors): High-speed switching in digital circuits.　　– JFETs (Junction Field-Effect Transistors): Used in amplifiers and analog switches.　　3. Applications: Triodes are essential in modern electronics:　　– Amplifiers in audio systems　　– Switching circuits in digital logic gates　　– Oscillators in radio frequency applications　　– Drivers for motors and relays　　Comparison– Function: Diodes primarily control current direction, whereas triodes amplify or switch currents.　　– Configuration: Diodes are two-terminal devices, while triodes (transistors) have three terminals: emitter, base, and collector.　　– Applications: Diodes are crucial for power supply and signal processing, while triodes are fundamental in amplification and digital switching.　　In conclusion, while diodes and triodes are both essential components in PCBA manufacturing, their distinct functionalities and applications make them suitable for different roles within electronic circuits. Understanding their differences is key to designing and assembling efficient and reliable electronic devices.
2024-08-16 14:24 reading：443
What is “component placement” in PCB?
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What is “component placement” in PCB?

　　Component placement is a critical step in the PCB assembly process where electronic components are precisely positioned and soldered onto the printed circuit board (PCB). This phase plays a crucial role in ensuring the functionality, reliability, and performance of the final electronic device. Let’s delve into the details of component placement in PCB assembly.　　How many electronic components are there?1. Surface Mount Devices (SMDs):　　– Passive Components: Resistors, capacitors, inductors.　　– Active Components: Integrated circuits (ICs), transistors, diodes.　　2. Through-Hole Components:　　– Components with leads that pass through holes drilled in the PCB.　　What is the component placement process?1. Design for Assembly (DFA)　　Before physical assembly begins, the PCB layout and design must consider DFA principles:　　– Component Orientation: Optimizing orientation for ease of assembly and efficient routing of traces.　　– Clearance and Spacing: Ensuring adequate space for soldering and avoiding interference between components.　　– Accessibility: Facilitating automated or manual assembly processes.　　2. Automated Component Placement　　Modern PCB assembly typically involves automated pick-and-place machines:　　– Vision Systems: Cameras identify fiducial markers or component outlines on the PCB to align and place components accurately.　　– Component Feeding: Components are loaded into feeders, which supply them to the pick-and-place machine.　　– Pick-and-Place Process: The machine picks components from the feeder using vacuum nozzles, aligns them precisely over corresponding pads on the PCB, and places them gently using controlled motion.　　3. Manual Component Placement　　For specialized components or low-volume production, manual placement may be used:　　– Skill and Precision: Technicians use hand tools like tweezers and magnifiers to place components accurately.　　– Prototype Builds: Initial prototypes or small batches may benefit from manual placement for flexibility and customization.　　What should be considered when placing components in PCB?Component placement is more than just arranging components on a board; it involves strategic decisions that impact the overall functionality and quality of the PCB. Proper placement not only ensures that the circuit operates correctly but also affects signal integrity, thermal management, and ease of assembly. Here are some crucial aspects to consider:　　1. Design for Signal Integrity　　Signal integrity is crucial for the proper operation of high-speed digital circuits and sensitive analog circuits. To maintain signal integrity:　　– Minimize Trace Length: Place critical components closer together to minimize trace lengths, reducing signal delay and electromagnetic interference (EMI).　　– Signal Paths: Follow a logical signal flow from input to output, avoiding crossing high-speed signals with noisy or high-current traces.　　– Grounding: Ensure a solid ground plane and place components that require low impedance connections to ground strategically to minimize noise and ground loops.　　2. Thermal Management　　Certain components, such as power transistors or voltage regulators, generate heat during operation. Efficient thermal management is essential to prevent overheating and ensure reliability:　　– Heat Sinks: Provide adequate space and mounting locations for heat sinks or thermal pads.　　– Airflow: Arrange components to allow natural or forced airflow across heat-generating components.　　– Isolation: Keep heat-sensitive components away from those generating significant heat to prevent thermal damage.　　3. Manufacturability and Assembly　　Designing for manufacturability involves ensuring that the PCB can be efficiently assembled with minimal errors and rework:　　– Component Accessibility: Ensure components are placed such that they can be easily soldered by hand or by automated pick-and-place machines.　　– Orientation: Align components consistently for ease of assembly and to avoid errors during soldering.　　– Clearance and Spacing: Adhere to manufacturing guidelines for minimum clearance between components, ensuring soldering and inspection can be done without issues.　　4. Electromagnetic Compatibility (EMC)　　PCB layout plays a crucial role in achieving EMC compliance by reducing EMI emissions and susceptibility:　　– Component Arrangement: Position sensitive components and traces to minimize loop areas and coupling.　　– Shielding: Group and shield sensitive components from noise sources such as high-current paths or switching circuits.　　– Grounding and Routing: Properly route and ground signal return paths to reduce loop areas and impedance discontinuities.　　Best Practices for Component Placement– Start with Critical Components: Begin by placing critical components such as microcontrollers, connectors, and high-frequency components based on their functional and spatial requirements.　　– Use Design Tools: Leverage PCB design software with simulation capabilities to visualize signal paths, analyze thermal performance, and optimize placement before fabrication.　　– Iterative Refinement: Iterate the placement based on simulation results, design reviews, and practical considerations to achieve the best balance of performance and manufacturability.　　– Documentation: Clearly label components with reference designators and polarity markings on the silkscreen layer. Maintain an updated BOM (Bill of Materials) to ensure accurate procurement and assembly.　　ConclusionComponent placement in PCB assembly is a pivotal stage where careful planning, advanced technology, and skilled craftsmanship converge to create reliable electronic devices. By adhering to DFA principles, leveraging automation, and considering thermal and signal integrity factors, manufacturers can achieve efficient, high-quality assembly that meets the demands of today’s electronics industry. As technology advances, component placement continues to evolve, driving innovation and pushing the boundaries of what’s possible in electronic design and manufacturing.
2024-07-18 11:48 reading：662
15 Common PCB Circuit Effects
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15 Common PCB Circuit Effects

　　Printed Circuit Boards (PCBs) are the backbone of modern electronics, serving as the foundation for countless devices we rely on daily. However, designing and working with PCBs come with its own set of challenges and nuances. In this guide, we delve into 15 common circuit effects that engineers and enthusiasts encounter when designing and troubleshooting PCBs.　　Each effect explored here sheds light on a specific aspect of PCB design, whether it’s related to signal integrity, power distribution, or electromagnetic interference. Through concise explanations and practical examples, we aim to equip readers with a deeper understanding of these effects, enabling them to optimize their PCB designs for performance, reliability, and manufacturability.　　Whether you’re a seasoned electronics engineer or a hobbyist diving into the world of PCB design, this guide is designed to serve as a valuable reference, helping you navigate the intricacies of PCB circuits with confidence and expertise.　　1. Drawbridging effectIn high-density wiring, when there is not enough space between two lines, a situation may occur where one line hangs over another line, similar to the shape of a suspension bridge.　　The drawbridging effect usually occurs in PCB design, especially in cases where a large number of signal lines need to be arranged and space is limited. The drawbridging effect may lead to problems such as signal crosstalk, electromagnetic interference, signal distortion, or delay.　　Measures to reduce the drawbridging effect:　　Reasonably plan the PCB layout, try to keep the signal lines arranged in a straight line, and avoid situations where lines cross or overlap.　　Optimize PCB routing, try to increase the spacing between signal lines as much as possible to avoid the suspension bridge effect caused by too small spaces.　　Use layered PCB design to arrange different signal lines on different layers to reduce crossing and interference between lines.　　Reduce electromagnetic interference between signal lines by appropriate signal layer and ground layer planning to improve the circuit’s anti-interference ability.　　2. Ripple effectIn high-speed circuits, when the signal transmission speed is fast, the signal may undergo ripple deformation when propagating on the PCB, affecting the signal quality, including signal distortion, clock offset, crosstalk, and interference.　　Measures to reduce ripple effects:　　Optimize PCB layout and routing to minimize the bending, crossing, and branching of signal lines, and maintain the consistency of signal transmission paths.　　Adopt appropriate signal line and ground design to reduce crosstalk and interference between signal lines, improving signal transmission quality.　　Use signal compensation or pre-emphasis technology to compensate for and enhance the signal, reducing waveform distortion and deformation.　　Choose appropriate signal transmission lines and signal processing devices to improve the circuit’s anti-interference ability and transmission speed.　　3. Overshoot effectSudden voltage changes that occur during signal transmission may cause excessive voltage shock to components on the circuit board, damaging components or causing circuit failures.　　Overshoot effects may be caused by excessively fast rising or falling edges of the signal, or by the instability of the signal transmission line or signal source.　　Measures to reduce overshoot effects:　　Optimize the design of signal transmission lines to ensure the impedance matching and stability of the signal lines.　　Use appropriate power filters and power decoupling capacitors to reduce interference from signal sources.　　Adopt signal pre-emphasis technology or signal compensation technology to preprocess or compensate the signal, reducing the occurrence of overshoot effects.　　Choose appropriate components and circuit protection devices to improve the circuit’s resistance to overshoot and stability.　　4. Resonance effectParameters such as inductance, capacitance, and impedance on the circuit board may cause resonance of the signal at specific frequencies, affecting the stable transmission of the signal. This resonance phenomenon usually occurs at specific frequencies when the frequency of external signals matches the resonant frequency of the circuit, causing resonance effects.　　Measures to reduce resonance effects:　　Optimize PCB layout and design to avoid situations where the circuit has a resonant frequency close to the excitation frequency.　　Use compensation circuits or filters to eliminate or suppress resonance effects.　　Choose appropriate damping components or damping materials to reduce the impact of resonance effects.　　Adopt appropriate circuit tuning techniques to stabilize the circuit’s frequency response within a specific frequency range.　　5. Floating EffectIn high-speed circuits, due to factors such as electromagnetic radiation, signals may float on the surface of conductors or circuit boards, affecting signal transmission and reception.　　To reduce the impact of PCB floating effect on circuits, designers can take the following measures:　　Measures to Reduce Floating Effect:　　Optimize PCB layout and design, plan the routing and spacing of signal lines reasonably, and minimize the impact of electromagnetic radiation on signal transmission.　　Use appropriate signal line and ground line designs to ensure impedance matching and stability of signal lines.　　Use shielding covers or shielding materials to reduce electromagnetic radiation and interference.　　Select suitable PCB materials and components to reduce the occurrence of floating effects.　　6. Crosstalk EffectDue to factors such as dense layout of PCB signal lines or electromagnetic interference, different signal lines may experience crosstalk. Crosstalk can lead to degradation of signal quality or abnormal circuit function.　　Measures to Reduce Crosstalk Effect:　　Optimize PCB layout and design, plan the routing and spacing of signal lines reasonably, and minimize mutual interference between signal lines.　　Use shielding covers, shielding materials, or ground isolation techniques to reduce the impact of electromagnetic interference on signals.　　Use differential signal transmission lines or increase signal layers to improve anti-interference capability and reduce the occurrence of crosstalk.　　Select suitable PCB materials and components to reduce the impact of crosstalk effects.　　7. Reflection EffectRefers to the phenomenon in high-speed signal transmission where signals encounter impedance mismatch or incomplete absorption of signal energy by the terminal of the signal transmission line, resulting in signals reflecting back to the original source end. This reflection effect may cause signal waveform distortion, affecting the transmission quality and stability of the circuit.　　Measures to Reduce Reflection Effect:　　Design signal transmission lines reasonably to ensure impedance matching and minimize impedance mismatch situations.　　Use terminal resistors or terminal capacitors to absorb signal energy and reduce signal reflection.　　Optimize PCB layout and design to minimize the length of signal transmission lines and reduce signal transmission delay.　　Select suitable PCB materials and components to reduce the impact of reflection effects.　　8. Shielding EffectThe metal layer or shielding cover on the PCB may shield signals, affecting the transmission range and quality of signals.　　Measures to Reduce Shielding Effect:　　Design PCB layout reasonably: Try to avoid overlap or proximity between signal lines and shielding areas to minimize the impact of shielding effect.　　Choose appropriate shielding materials: Select suitable metal layers or shielding cover materials in PCB design to have good shielding performance while minimizing the impact on signal transmission.　　Design suitable grounding structure: A good grounding structure can help reduce the shielding effect of signals and improve signal transmission quality.　　Pay attention to signal adjustment: For signals that need to pass through shielding areas, signal adjustment techniques can be employed to minimize the impact of shielding effect, such as increasing signal power or adjusting signal transmission methods.　　9. Thermal Expansion EffectTemperature changes may cause thermal expansion or contraction of PCB materials, affecting the dimensional stability of circuit boards and the connection status of components.　　Measures to Reduce Thermal Expansion Effect:　　Choose appropriate PCB materials: Selecting PCB materials with smaller coefficients of thermal expansion can reduce the impact of thermal expansion on circuits.　　Design PCB layout reasonably: During PCB design, try to avoid direct connection between materials with high coefficients of thermal expansion and those with low coefficients to reduce the impact of thermal expansion.　　Control soldering temperature: Control soldering temperature and time during the soldering process to avoid excessive temperature leading to solder joint failure or component displacement.　　Use support structures: Adding appropriate support structures in PCB design can reduce PCB bending deformation, improving the stability and reliability of the PCB.　　10. Ground Hole EffectThere are many ground holes on the PCB. When ground holes are close to signal lines or other ground holes, ground hole effect may occur, affecting the stability of signal transmission.　　Measures to Reduce Ground Hole Effect:　　Design ground holes reasonably: Design appropriate parameters for ground holes, such as diameter, pitch, copper foil diameter, etc., to ensure impedance matching and consistency of ground holes, reducing ground hole inductance and crosstalk effects.　　Use ground hole filling: Ground hole filling techniques can be employed in PCB design to fill ground holes, reducing their impact on signal transmission and improving PCB performance stability.　　Optimize layout: Plan PCB layout reasonably to minimize the number and density of ground holes, reducing their impact on circuits.　　Adjust interlayer stacking: Choose PCB layer stacking methods appropriately to minimize ground holes between inner and outer layers, reducing the impact of ground hole effect.　　11. Filling EffectThe filling material on the PCB may affect signal transmission. For example, differences in the dielectric constant of the filling material may cause changes in signal transmission speed or signal attenuation.　　Measures to Reduce Filling Effect:　　Choose filling material reasonably: Select filling materials with a dielectric constant close to that of the PCB material to reduce the impact of dielectric constant differences on signal transmission.　　Control the thickness of filling material: Properly control the thickness of filling material to avoid excessive thickness, which could lengthen the signal transmission path and increase attenuation.　　Optimize PCB layout: During PCB design, minimize the impact on signal transmission paths, plan filling areas reasonably, and avoid interference from filling materials on signal transmission paths.　　Use low-loss filling materials: Choose filling materials with low resistance and dielectric loss to minimize attenuation and distortion during signal transmission.　　12. Temperature Drift EffectTemperature changes on the PCB may cause thermal expansion or contraction of circuit board materials, thereby affecting the dimensional stability of the circuit board and the connection status of components.　　Measures to Reduce Temperature Drift Effect:　　Choose PCB materials reasonably: Select PCB materials with good thermal stability and dimensional stability to reduce the impact of temperature changes on the PCB.　　Control soldering temperature: During the soldering process, control soldering temperature and time properly to avoid excessive soldering temperature leading to damage or breakage of components and solder joints.　　Optimize PCB layout: Plan PCB layout reasonably to reduce differences in thermal expansion coefficients between components and avoid changes in the connection status of components due to temperature changes.　　Temperature environment control: Control temperature changes in the PCB usage environment to avoid significant temperature shocks to the PCB, thereby reducing the impact of temperature changes on PCB circuits.　　13. Crystal EffectDevices such as transistors in PCB routing may be influenced by the surrounding environment, causing changes in device parameters and affecting circuit performance.　　Measures to Reduce Crystal Effect:　　Rational Layout: Properly plan PCB layout to avoid external interference affecting devices such as transistors and minimize electromagnetic field interference with devices.　　Temperature Control: Take measures to control the operating temperature of the PCB board during design and manufacturing to reduce the influence of temperature changes on device parameters and improve circuit stability.　　Choose Appropriate Devices: Select transistors and other devices with good anti-interference and stability to reduce the impact of crystal effect on the circuit.　　Design Compensation Circuits: In PCB design, compensation circuits can be used to correct drift in device parameters, improving circuit performance and stability.　　14. Restricted EffectThere are some restricted areas on the PCB, such as edges, power supply areas, etc., which may impose certain limitations or impacts on signal transmission or routing.　　Measures to Reduce Restricted Effect:　　Rational Planning of Layout: During PCB design, plan the layout reasonably to avoid placing sensitive signal lines or components near restricted areas, reducing the impact of restrictions.　　Electromagnetic Shielding: For areas prone to electromagnetic interference in restricted areas, electromagnetic shielding measures can be adopted, such as placing metal shielding covers around sensitive areas to reduce the impact of external electromagnetic interference on the circuit.　　Optimization of Power Supply Design: For possible power supply instability or noise issues in power supply areas, measures such as optimizing power supply design, adding filtering circuits, and reducing power supply noise can be taken to improve power supply stability and circuit performance.　　Fine Routing: When routing in restricted areas, adopt fine routing methods as much as possible to reduce restrictions or elongation of signal transmission paths, improving signal transmission rate and stability.　　15. Landmine EffectHidden problems or faults on PCB boards may suddenly appear during subsequent testing or use, causing unexpected impacts or damage to the circuit board.　　Measures to Reduce Landmine Effect:　　Strict Quality Control: During PCB production, strictly control the quality of each process to ensure that each component and circuit connection meets specifications, reducing hidden dangers.　　Perfect Testing Procedures: Establish comprehensive testing and inspection procedures to conduct comprehensive testing and inspection of PCB circuits, promptly identify and repair potential problems.　　Use Reliable Components: Choose components and materials with high reliability and stable quality to reduce the probability of failure and minimize the occurrence of landmine effects.　　Strengthen Maintenance: Regularly maintain and upkeep produced PCB circuits, promptly identify and repair potential problems, improving circuit reliability and stability.
2024-04-30 10:11 reading：526
What is the difference between the package substrate and PCB
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What is the difference between the package substrate and PCB

　　The packaging substrate is a kind of electronic substrates that can provide electrical connection, protection, support, heat dissipation, assembly and other functions for chips and electronic components, so as to achieve multi-pin, reduce the volume of packaged products, improve electrical performance and heat dissipation, ultra-high density or multi-chip modularization and high reliability.　　The packaging substrate can be considered as a PCB or thin-thick film circuit substrate with higher performance or special functions. The packaging substrate plays the role of electrical interconnection and transition between the chip and the conventional printed circuit board (mostly motherboard, sub-board, backplane, etc.), and also provides protection, support, heat dissipation, assembly and other functions for the chip.　　With the continuous progress and development of electronic installation technology, the boundaries of various levels of electronic installation are becoming less and less clear. The role of PCB is becoming more and more important. Higher and newer requirements are put forward for PCB and its substrate materials in terms of function and performance.　　Difference between package substrate and PCB　　Printed Circuit Board (PCB) refers to a circuit board that forms a copper circuit pattern on a copper clad laminate according to a predetermined design. Its main function is to connect various electronic components according to a predetermined circuit and act as an electrical connection.　　The packaging substrate and PCB manufacturing principles are similar. It is the extension of PCB to high-end technology to adapt to the rapid development of electronic packaging technology. There is a certain correlation between the two. The packaging substrate is a high-end PCB.　　package substrate　　In electronic packaging engineering, the electronic substrate (PCB) can be used for different levels of electronic packaging (mainly used for the 2nd to 5th levels of the 1st to 3rd level packaging), but the packaging substrate is used for the 2nd and 3rd levels of the 1st and 2nd level packaging, Ordinary PCBs are used for levels 3, 4, and 5 of level 2 and level 3 packages.　　However, they all provide functions such as interconnection, protection, support, heat dissipation, and assembly for electronic components to achieve multi-pin, reduce the volume of packaged products, improve electrical performance and heat dissipation, ultra-high density or multi-chip modularization, and high reliability for the purpose.　　The process and reasons for the separation of the package substrate from the PCB　　After the 1980s, with the wide application of new materials and new equipment, integrated circuit design and manufacturing technology developed rapidly in accordance with “Moore’s Law”, tiny and sensitive semiconductor components came out, large-scale integrated circuits and ultra-large-scale integrated circuits appeared, and high-density multilayer packaging substrates emerged as the times require, which separates integrated circuit packaging substrates from ordinary printed circuit boards. A proprietary manufacturing technology for integrated circuit packaging substrates then formed.　　At present, among the mainstream products of conventional PCB boards, products with a line width/line spacing of 50μm/50μm belong to high-end PCB products. However, this technology still cannot meet the technical requirements of the current mainstream chip packaging. In the field of packaging substrate manufacturing, products with a line width/line spacing of 25μm/25μm have become more common, which reflects that packaging substrate manufacturing is more advanced in technology than conventional PCB manufacturing.　　There are two fundamental reasons for the separation of packaging substrates from conventional printed circuit boards: on the one hand, because the development speed of PCB boards is lower than that of chips, it is difficult to directly connect chips and PCB boards. On the other hand, the cost of the PCB board refinement is much higher than the cost of interconnecting the PCB and the chip through the packaging substrate.　　Main structure and production technology of package substrate　　At present, there is no unified classification standard in the packaging substrate industry. Packaging substrate is usually classified according to the substrate material and manufacturing technology applicable to substrate manufacturing.　　According to different substrate materials, packaging substrates can be divided into inorganic packaging substrates and organic packaging substrates. Inorganic packaging substrates mainly include: ceramic-based packaging substrates and glass-based packaging substrates. Organic packaging substrates mainly include: phenolic packaging substrates, polyester packaging substrates, and epoxy resin packaging substrates.　　Organic Package Substrate　　According to the different manufacturing methods of the packaging substrate, the packaging substrate can be divided into a core packaging substrate and a new coreless packaging substrate.　　Core and coreless packaging substrates　　The core package substrate is mainly divided into two parts in structure, the middle part is the core board, and the upper and lower parts are laminated boards. The production technology of the core packaging substrate is based on the high-density interconnection (HDI) printed circuit board production technology and its improved technology.　　Core and coreless packaging substrates　　A coreless substrate refers to a packaging substrate with a core board removed. The fabrication of the new coreless package substrate mainly produces interlayer conductive structures—copper pillars—by bottom-up electrodeposition technology. It only uses an insulating layer (Build-up Layer) and a copper layer to achieve high-density wiring through a semi-additive (SemiAdditive Process, abbreviated as SAP) build-up process.　　Advantages and disadvantages of coreless packaging substrates　　Advantages　　Thinning;　　The electrical transmission path is reduced, the AC impedance is further reduced, and its signal line effectively avoids the return loss generated by the PTH (copper plated through hole) on the traditional core substrate, which reduces the inductance of the power system loop and improves the transmission. characteristics, especially frequency characteristics;　　The direct transmission of signals can be realized, because all circuit layers can be used as signal layers, which can improve the freedom of wiring, realize high-density wiring, and reduce the limitation of C4 layout;　　Except for some processes, the original production equipment can be used, and the process steps are reduced.　　Disadvantages　　Without core board as support, it is easy to warp and deform in the manufacture of coreless substrates, which is the most common and biggest problem at present;　　Laminate shattering is prone to occur;　　Some new equipment for coreless substrates for semiconductor packaging needs to be introduced. Therefore, the challenges of coreless substrates for semiconductor packaging mainly lie in materials and processes.
2024-03-14 17:12 reading：830
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