三星电机将重点投入汽车MLCC,与日本村田竞争

Release time:2024-02-21
author:AMEYA360
source:网络
reading:1889

  智能手机需求持续低迷,制造多层陶瓷电容器(MLCC)的全球电子元件公司通过扩大汽车MLCC业务寻求突破,韩国领先的MLCC公司三星电机将投资重点放在汽车MLCC,该市场一直由日本企业主导。

三星电机将重点投入汽车MLCC,与日本村田竞争

  近期,占据全球MLCC市场份额第一的日本村田最近宣布,计划投资470亿日元(约合3.14亿美元)扩大日本岛根县出云市工厂的MLCC生产设施,该设施计划于2026年3月开始运营。

  业界推测,随着智能手机销量增长放缓,此次扩建旨在提高针对电动汽车(EV)市场和物联网(IoT)等市场的产能。

  MLCC已广泛应用于智能手机和个人电脑(PC)等IT设备以及家用电器中。最近,电动汽车和自动驾驶汽车的出现凸显了汽车MLCC市场作为电子元件行业的新领域。汽车MLCC市场规模预计将从2023年的29亿美元增长到2026年的40亿美元。

  继村田之后,日本TDK、太阳诱电、国巨等全球MLCC领先企业也将汽车MLCC作为重点竞争领域,积极投资。太阳诱电于2023年7月在江苏常州建成了MLCC生产基地,并开始量产,专注于针对中国电动汽车市场的汽车MLCC。

  三星电机在去年3月的股东大会上宣布转型为汽车零部件公司,在日系企业单打独斗的情况下,加紧加强在车用MLCC市场的占有率。

  根据市场研究公司TrendForce数据,自2016年开始全面生产汽车MLCC以来,三星电机的市场份额迅速增长,从2022年的4%增至2023年的13%。同期,村田制作所(从44%下降到41%)、TDK(从20%下降到16%)、太阳诱电(从18%下降到13%)等龙头企业的市场份额有所下降。

("Note: The information presented in this article is gathered from the internet and is provided as a reference for educational purposes. It does not signify the endorsement or standpoint of our website. If you find any content that violates copyright or intellectual property rights, please inform us for prompt removal.")

Online messageinquiry

reading
  • Week of hot material
  • Material in short supply seckilling
model brand Quote
CDZVT2R20B ROHM Semiconductor
BD71847AMWV-E2 ROHM Semiconductor
RB751G-40T2R ROHM Semiconductor
MC33074DR2G onsemi
TL431ACLPR Texas Instruments
model brand To snap up
STM32F429IGT6 STMicroelectronics
TPS63050YFFR Texas Instruments
ESR03EZPJ151 ROHM Semiconductor
IPZ40N04S5L4R8ATMA1 Infineon Technologies
BU33JA2MNVX-CTL ROHM Semiconductor
BP3621 ROHM Semiconductor
Hot labels
ROHM
IC
Averlogic
Intel
Samsung
IoT
AI
Sensor
Chip
About us

Qr code of ameya360 official account

Identify TWO-DIMENSIONAL code, you can pay attention to

AMEYA360 weixin Service Account AMEYA360 weixin Service Account
AMEYA360 mall (www.ameya360.com) was launched in 2011. Now there are more than 3,500 high-quality suppliers, including 6 million product model data, and more than 1 million component stocks for purchase. Products cover MCU+ memory + power chip +IGBT+MOS tube + op amp + RF Bluetooth + sensor + resistor capacitance inductor + connector and other fields. main business of platform covers spot sales of electronic components, BOM distribution and product supporting materials, providing one-stop purchasing and sales services for our customers.

Please enter the verification code in the image below:

verification code