重组半导体采购战略！大众与10家芯片厂商签订采购协议

Release time：2023-08-30
author：AMEYA360
source：网络
reading：2375

　　导读： 当时时间8月23日，据路透社报道，大众汽车已开始直接从包括恩智浦(NXP)、英飞凌和瑞萨电子在内的10家芯片厂商采购芯片。

　　2022年成立的大众汽车零部件供应工作组负责人Karsten Schnake表示，这家德国汽车制造商此前依赖零部件供应商购买芯片，去年10月开始与芯片制造商达成直接协议，以确保供应安全。

重组半导体采购战略！大众与10家芯片厂商签订采购协议

　　大众乘用车品牌采购主管Dirk Grosse-Loheide表示：“全球市场容量不足，我们必须积极行动。”

　　随着电动汽车的生产和对日益复杂的软件的需求，汽车行业对芯片的需求急剧增加。由于设立芯片工厂的复杂性，芯片供应的增长一直比较缓慢。

　　2022年7月，大众汽车和意法半导体宣布共同开发一种新型半导体，这标志着大众汽车首次与二三级半导体供应商建立直接合作关系。

　　同时，德国政府一直在用数十亿欧元的补贴来吸引芯片制造商，包括将在德设厂的英特尔和台积电。

　　Karsten Schnake表示，大众汽车尚未与全球最大的芯片代工企业台积电建立直接供应关系，但每隔几周就会与他们会面一次，传达其需求情况。他补充说，大众汽车还计划减少其车辆所需的芯片种类，以简化供应链，这也将有助于简化其软件产品。

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