产品特点
小巧轻盈
基于合金厚膜和三层电极构造的高可靠性
采用适合自动贴片机的带状包装
焊接方式:应对回流焊及浸流焊
高精度电阻值容差
√ ERJXG 1G/2R/3E/6E/8E/14/12/1T系列:±1%
√ ERJ1R 2R/3R/6R系列:±0.5%
参考标准 : IEC 60115-8, JIS C 5201-8, JEITA RC-2134C
符合AEC-Q200 (除了ERJ1R, ERJXG, ERJ1GN)
已应对RoHS指令
产品性能
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model | brand | Quote |
---|---|---|
TL431ACLPR | Texas Instruments | |
MC33074DR2G | onsemi | |
BD71847AMWV-E2 | ROHM Semiconductor | |
RB751G-40T2R | ROHM Semiconductor | |
CDZVT2R20B | ROHM Semiconductor |
model | brand | To snap up |
---|---|---|
IPZ40N04S5L4R8ATMA1 | Infineon Technologies | |
BU33JA2MNVX-CTL | ROHM Semiconductor | |
BP3621 | ROHM Semiconductor | |
ESR03EZPJ151 | ROHM Semiconductor | |
STM32F429IGT6 | STMicroelectronics | |
TPS63050YFFR | Texas Instruments |
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