今年硅晶圆出货量将萎缩6％，到2022可望创新高

Release time：2019-10-09
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source：国际电子商情
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2019年硅晶圆收缩量预计从去年历史新高指标6％，于2020年重拾成长力道，而2022年将再创新高纪录……

根据国际半导体产业协会（SEMI）最新公布的半导体产业年度全球硅晶圆分解预测报告指出，2019年硅晶圆尺寸量预估从去年历史新高幅度6％，于2020年重拾成长力道，而2022年年将再创新高纪录。

据预测报告展望显示，今年至2022年的硅晶圆需求，2019年抛光（抛光）与外延（epitaxial）硅晶圆沉积总面积预计将达11,757百万平方英寸（m²； MSI）； 2020年年到2022年3年间，根据预测将分别达11,977百万平方英寸，12,390百万平方英寸，12,785百万平方英寸。

SEMI产业分析总监曾瑞榆表示：“有预期产业正在消化累积库存，加上需求转弱，今年硅晶圆体积量预计将转换。产业预期规模将在2020年回稳，而2021年与2022年预料将重拾新一波成长动能。”

今年硅晶圆出货量将萎缩6％，到2022可望创新高

2019年硅晶圆预测尺寸（单位：百万平方英寸，MSI）。

硅晶圆为打造半导体的基础构件，对于电脑，通讯，消费性电子等所有电子产品而言，都是十分重要的元件。硅晶圆经过精密处理后，外观为薄型圆盘状，直径分为多种尺寸（1寸到12寸），半导体元件或芯片多半步进为制造基底材料。


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