Chip Sales Growth Slows

Release time:2018-09-07
author:Ameya360
source:EE Times
reading:1145

Semiconductor sales increased again in July, but may finally be showing signs of cooling.

The three-month average of chip sales grew to $39.5 billion in July, up 17.4% from July 2017, according to the Semiconductor Industry Association. While the year-to-year growth rate remains healthy, July snapped a streak of 15 consecutive months of greater than 20% year-to-year increases. 

Chip sales also increased on a sequential basis — just barely. The three-month average of chip sales in July was up by a modest 0.4%, according to the SIA, which reports sales data compiled by the World Semiconductor Trade Statistics organization. 

“The global semiconductor industry posted its highest-ever monthly sales in July, easily outpacing last July and narrowly ahead of last month’s total,” said John Neuffer,SIA's  president and CEO, in a statement. “Sales were up year-to-year across every major semiconductor product category and regional market, with the China and Americas markets leading the way with growth of greater than 20%.”

Sales increased on an annual basis by 29.4% in China, 20.7% in the Americas, 11.7% in Europe, 11.5% in Japan and 5.7% in the Asia-Pacific region, according to the SIA. On a month-to-month basis, sales were up 1.7% in China, 0.4% in the Americas and were flat in the Asia-Pacific region, with both Europe and Japan experiencing decreases, the SIA said.

("Note: The information presented in this article is gathered from the internet and is provided as a reference for educational purposes. It does not signify the endorsement or standpoint of our website. If you find any content that violates copyright or intellectual property rights, please inform us for prompt removal.")

Online messageinquiry

reading
Sensors for Smart Technology Applications Reaching 8 Billion Units in 2020
China’s semiconductor fab capacity to reach 20% worldwide share in 2020
The China IC Ecosystem Report, a comprehensive report for the IC manufacturing supply chain, reveals that front-end fab capacity in China will grow to account for 16 percent of the world’s semiconductor fab capacity this year, a share that will increase to 20 percent by the end of 2020. With the rapid growth, China will top the rest of the world in fab investment in 2020 with more than $20 billion in spending, driven by memory and foundry projects funded by both multinational and domestic companies, according to the new report released today by SEMI.The report also shows that IC Design remained the largest semiconductor sector in China for the second year in a row with $31.9 billion in revenue in 2017, widening its lead over the long-dominant IC Packaging and Test sector. The ascent of China’s IC Design sector comes as the region’s equipment market is expected to claim the top spot in 2020 for the first time on the strength of the continuing development of its domestic manufacturing capability. China’s maturing domestic fab sector is also benefiting domestic equipment and materials suppliers. Both groups continue to see gains in their product offerings and capabilities, particularly in silicon wafer production. The China IC Ecosystem Report is produced by SEMI, the global industry association and provider of independent electronics market research.The more than RMB140 billion (US$21.5 billion) accumulated by the National IC Fund, a critical component of the 2014 National Guideline to address China’s semiconductor trade deficit, has spurred rapid gains throughout the region’s IC supply chain. Semiconductors are China’s largest import by revenue. Phase 2 of funding aims to raise another RMB150-200 billion ($23.0-$30.0 billion).Encouraged by the National Guideline and favorable policies, skilled overseas talent is returning to China, triggering an explosion of domestic IC Design start-ups that are benefiting from access to investment and favorable policies, the report shows.Other highlights from The China IC Ecosystem Report include:Currently 25 new fab construction projects are underway or planned in China. 17 – 300 mm fabs are being tracked as part of this investment and expansion activity. Foundry, DRAM and 3D NAND are the leading segments for fab investment and new capacity in China.China’s IC Packaging and Test industry is also moving up the value chain by enhancing its technology offerings through mergers and acquisitions and building advanced capabilities to entice international integrated device manufacturers.China’s IC materials market, currently dominated by Packaging materials, became the second largest regional market for materials in 2016, a position it solidified in 2017. China’s materials market is expected to grow at a 10 percent CAGR from 2015 to 2019, driven primarily by the region’s new fab capacity ramp in the coming years. Fab capacity will expand at a 14 percent CAGR during that period.
2018-09-05 00:00 reading:1203
Production Costs of Large-Size Panels to Drop by Only 1~1.5% QoQ in 3Q18 Due to Tight Supply of Components
According to the Large Size Panel Cost Breakdown, the latest report by WitsView, a division of TrendForce, the overall production costs of large-size panels are estimated to drop by 1~1.5% QoQ in 3Q18, less than 2~2.5% in 2Q. This is because the components of panels have a relatively limited price drop influenced by the tight supply. Moreover, the panel makers still face the amortization of equipment capital expenditure for new technologies including narrow-bezel, Mini LED and inkjet printing OLED.Components like driver ICs and polarizers are in tight supply during the peak season“As the new capacity of Chinese panel makers increases the demand for glass substrates, the glass manufacturers do not have enough capacity of cutting glass sheets for Gen 6 or more advanced fabs,” says Julian Lee, the assistant research manager of WitsView. The polarizers see a tight supply in 3Q18, as Nitto’s fab in Japan experienced discontinued production and transportation for several days due to the continual rain in July. Meanwhile, other polarizer manufacturers have been unable to increase the supply, since their production lines have already been operated with a full availability during the peak season. However, the tight supply of glass substrates and polarizers is expected to be eased in the fourth quarter.The supply of driver ICs has also been insufficient in 1H18 due to the foundries’ adjustment in wafer starts. The undersupply has become more severe in the traditional peak season, and is expected to continue to the fourth quarter. Meanwhile, the capacity for testing and packaging, as well as Film (COF) also faces an undersupply, as TDDI solutions for smartphones see higher demand and the production of new iPhones is scheduled in the short term.In addition, it is difficult for panel makers to bargain with backlight module suppliers, because the prices of backlight module components, such as optical coatings and LEDs, have reached almost the lowest level.Rebounding panel prices may improve the profitability of panel makersThe TV panel prices have already rebounded since July, although the cost reduction of panels is lower than expected. IT panel prices have shown a flat trend or even a slight increase, which may improve the profitability of panel makers. For example, the cash cost of 32-inch TV panel is about US$43~44/piece, but the quote for it has rebounded higher than that in the third quarter. Similarly, the cash cost of 65-inch panel is about US$210~ 220/piece, of which the quote is at least US$230~240/piece in the third quarter. Overall, the profitability of most panel makers in 3Q18 is expected to be better than in 2Q.
2018-08-24 00:00 reading:889
  • Week of hot material
  • Material in short supply seckilling
model brand Quote
BD71847AMWV-E2 ROHM Semiconductor
MC33074DR2G onsemi
TL431ACLPR Texas Instruments
RB751G-40T2R ROHM Semiconductor
CDZVT2R20B ROHM Semiconductor
model brand To snap up
BP3621 ROHM Semiconductor
IPZ40N04S5L4R8ATMA1 Infineon Technologies
ESR03EZPJ151 ROHM Semiconductor
TPS63050YFFR Texas Instruments
STM32F429IGT6 STMicroelectronics
BU33JA2MNVX-CTL ROHM Semiconductor
Hot labels
ROHM
IC
Averlogic
Intel
Samsung
IoT
AI
Sensor
Chip
About us

Qr code of ameya360 official account

Identify TWO-DIMENSIONAL code, you can pay attention to

AMEYA360 weixin Service Account AMEYA360 weixin Service Account
AMEYA360 mall (www.ameya360.com) was launched in 2011. Now there are more than 3,500 high-quality suppliers, including 6 million product model data, and more than 1 million component stocks for purchase. Products cover MCU+ memory + power chip +IGBT+MOS tube + op amp + RF Bluetooth + sensor + resistor capacitance inductor + connector and other fields. main business of platform covers spot sales of electronic components, BOM distribution and product supporting materials, providing one-stop purchasing and sales services for our customers.

Please enter the verification code in the image below:

verification code