搭载汇顶科技超薄指纹方案,华为Mate 10闪耀慕尼黑

Release time:2017-10-18
author:
source:国际电子商情
reading:1424

2017年10月16日,华为品牌高端旗舰手机——Mate 10在德国慕尼黑震撼发布。除了拥有“智慧大脑”麒麟970芯片,在“内涵”上以创新引领人工智能时代之外, Mate 10的另一大亮点是实现了高屏占比与超薄正面指纹的完美融合,满足了消费者对人机交互体验与视觉审美的极致追求。

首发上市的Mate 10选择搭载由汇顶科技独家提供的超薄指纹方案,这是继华为P10/P10 Plus、Matebook X、荣耀系列旗舰机型之后,汇顶科技与华为又一次重磅合作。

汇顶超薄指纹识别方案 为更高屏占比而生

全面屏风潮来袭,移动终端厂商对高屏占比有了更高的追求,使得手机正面集成指纹的设计难度更大。汇顶科技全球首创的超薄指纹识别方案,基于成熟的电容式指纹识别技术,不断融合芯片设计和软件算法的创新,将客户的这一难题转化为能同时满足高屏占比和正面解锁的创新解决方案。该方案具备超厚盖板穿透能力和超薄芯片的独有优势,实现多重差异化价值:

 超薄芯片:全嵌入式超薄指纹芯片设计,芯片最薄支持0.3mm,模组厚度0.86mm,能够支持更窄手机正面下巴区。

 更佳性能:创新的芯片电路设计结合用户数据智能学习算法,待机功耗降低60%,最高支持250μm玻璃/蓝宝石盖板或175μm陶瓷盖板,更耐磨耐刮擦,实现更佳用户体验。

聚焦客户需求创新 赢得全球品牌客户信赖

华为作为全球顶尖科技企业的集大成者,一直致力于为用户提供卓越的科技产品,其中Mate系列更是华为对“极致科技”追求的精诚之作。作为华为的长期合作伙伴,汇顶科技深刻理解华为对于产品创新的追求。汇顶科技生物识别产品线总经理龙华表示:“我们很荣幸与华为又一次深度合作,以科技创新为源动力,为客户产品赋能,助力客户赢得新的商业成功。”面向未来,汇顶科技将持续创新,为客户带来产品价值和商业价值的提升,为全球消费者带来更安全、智能、便捷的使用体验。

("Note: The information presented in this article is gathered from the internet and is provided as a reference for educational purposes. It does not signify the endorsement or standpoint of our website. If you find any content that violates copyright or intellectual property rights, please inform us for prompt removal.")

Online messageinquiry

reading
  • Week of hot material
  • Material in short supply seckilling
model brand Quote
CDZVT2R20B ROHM Semiconductor
TL431ACLPR Texas Instruments
RB751G-40T2R ROHM Semiconductor
MC33074DR2G onsemi
BD71847AMWV-E2 ROHM Semiconductor
model brand To snap up
IPZ40N04S5L4R8ATMA1 Infineon Technologies
ESR03EZPJ151 ROHM Semiconductor
BU33JA2MNVX-CTL ROHM Semiconductor
STM32F429IGT6 STMicroelectronics
TPS63050YFFR Texas Instruments
BP3621 ROHM Semiconductor
Hot labels
ROHM
IC
Averlogic
Intel
Samsung
IoT
AI
Sensor
Chip
About us

Qr code of ameya360 official account

Identify TWO-DIMENSIONAL code, you can pay attention to

AMEYA360 weixin Service Account AMEYA360 weixin Service Account
AMEYA360 mall (www.ameya360.com) was launched in 2011. Now there are more than 3,500 high-quality suppliers, including 6 million product model data, and more than 1 million component stocks for purchase. Products cover MCU+ memory + power chip +IGBT+MOS tube + op amp + RF Bluetooth + sensor + resistor capacitance inductor + connector and other fields. main business of platform covers spot sales of electronic components, BOM distribution and product supporting materials, providing one-stop purchasing and sales services for our customers.

Please enter the verification code in the image below:

verification code