- Ameya360 Component Supply Platform >
- Trade news >
- 传苹果A15芯片采用台积电下一代5nm+工艺，iPhone 13将搭载
传苹果A15芯片采用台积电下一代5nm+工艺，iPhone 13将搭载
Release time：2020-11-20
author：Ameya360
source：eefocus
reading：1790
据悉，苹果 iPhone 12 所搭载的 A14 仿生芯片是智能手机行业中第一个基于 5nm 工艺制造的芯片。消息称苹果及其芯片制造合作伙伴台积电在更先进的节点上取得了进步。
研究公司 TrendForce 日前表示，苹果计划在 2021 年的 iPhone 中将台积电的下一代 5nm+工艺用于 A15 芯片。据台积电网站显示，5nm+工艺(被称为 N5P)是其 5nm 工艺的 “性能增强版本”，将提供额外的功率效率和性能改进。
此外，TrendForce 认为 2022 年 iPhone 的 A16 芯片很有可能将基于台积电未来的 4nm 工艺制造，从而为进一步提高性能、电源效率和密度铺平了道路。
这些工艺上的改进使得未来 iPhone 能够继续引领手机行业，提高电池效率并延长电池寿命。鉴于台积电目前还代工生产 5nm 工艺的 Apple Silicon M1 芯片，这意味着台积电未来还将会推出 M1X 或者 M2 芯片。
另有消息称，除了重新设计的 24 英寸 iMac 和更小的 Mac Pro 外，未来的 Apple Silicon Mac 还将包括 14 英寸和 16 英寸的新款 MacBook Pro，最早将于 2021 年第二季度推出，拥有全新的外观。
（"Note: The information presented in this article is gathered from the internet and is provided as a reference for educational
purposes. It does not signify the endorsement or standpoint of our website. If you find any content that violates copyright or
intellectual property rights, please inform us for prompt removal."）
Previous：又一家国产老牌车企破产重整！
Online messageinquiry
reading
Popular categories
- Week of hot material
- Material in short supply seckilling
| model | brand | Quote |
|---|---|---|
| MC33074DR2G | onsemi | |
| CDZVT2R20B | ROHM Semiconductor | |
| BD71847AMWV-E2 | ROHM Semiconductor | |
| TL431ACLPR | Texas Instruments | |
| RB751G-40T2R | ROHM Semiconductor |
| model | brand | To snap up |
|---|---|---|
| IPZ40N04S5L4R8ATMA1 | Infineon Technologies | |
| STM32F429IGT6 | STMicroelectronics | |
| ESR03EZPJ151 | ROHM Semiconductor | |
| BP3621 | ROHM Semiconductor | |
| BU33JA2MNVX-CTL | ROHM Semiconductor | |
| TPS63050YFFR | Texas Instruments |
Hot labels
ROHM
IC
Averlogic
Intel
Samsung
IoT
AI
Sensor
Chip
Information leaderboard
About us
Qr code of ameya360 official account
Identify TWO-DIMENSIONAL code, you can pay attention to
AMEYA360 mall (www.ameya360.com) was launched in 2011. Now there
are more than 3,500 high-quality suppliers, including 6 million product model data,
and more than 1 million component stocks for purchase. Products cover MCU+ memory +
power chip +IGBT+MOS tube + op amp + RF Bluetooth + sensor + resistor capacitance
inductor + connector and other fields. main business of platform covers spot sales
of electronic components, BOM distribution and product supporting materials,
providing one-stop purchasing and sales services for our customers.
Please enter the verification code in the image below：