英特尔成为台积电和三星眼中的“肥肉”

Release time:2020-10-28
author:
source:eefocus
reading:1600

周一最新消息显示,虽然英特尔的 7nm 工艺面临瓶颈,但是该企业仍在继续推进这一领域的研发。不过,另一个消息称,英特尔可能要开始需求第三方企业为其代工。

 

美最后一个芯片制造巨头开始寻求代工,这动作意义深远。台积电、三星芯片代工模式模式冲击很大,英特尔逐渐力不从心,去年英特尔出现了因芯片订单剧增产能不足状况,对其客户发表了致歉信。

 

这样,英特尔变成三星或者台积电眼中的“肥肉”。

 

据台湾地区媒体报道,英特尔近期已与台积电达成协议,预订了台积电明年 18 万片 6nm 芯片产能,据估算,这批芯片外包代工业务或超过 200 亿美元规模,如果情况属实的话,这将成为台积电失去华为这一大客户之后的一笔新增大单,在订单方面并不发愁的台积电,后续压力是如何满足迅速扩大的产能需求。


昨天,有消息称,英特尔首席架构师 Raja Koduri 下周将在三星的“高级代工生态系统”(SAFE)论坛会议上发表“2025 年人工智能将增加 1000 倍算力”的演讲。此前,Raja Koduri 在推特上贴了一张去年到访韩国三星工厂的照片,引发了有关英特尔将使用三星为其 Xe 显卡芯片提供代工的传言。考虑到英特尔最近明确宣布将把某些芯片外包生产,却仍未透露该策略的详细情况,这让 Koduri 与三星最近的互动变得意味深长。

 

相信台积电和三星都非常渴望拿到英特尔的订单,因为这会给它们带来十分可观的收入,同时,也会使整个半导体业对其实力和影响力的认知有更近一步的提升。特别是三星,自从进入 10nm 时代以后,其与台积电的竞争一直处于下风,若能拿到英特尔的大单,无疑是一种振奋,可进一步增强其今后与台积电竞争的底气和决心。


("Note: The information presented in this article is gathered from the internet and is provided as a reference for educational purposes. It does not signify the endorsement or standpoint of our website. If you find any content that violates copyright or intellectual property rights, please inform us for prompt removal.")

Online messageinquiry

reading
  • Week of hot material
  • Material in short supply seckilling
model brand Quote
CDZVT2R20B ROHM Semiconductor
TL431ACLPR Texas Instruments
RB751G-40T2R ROHM Semiconductor
MC33074DR2G onsemi
BD71847AMWV-E2 ROHM Semiconductor
model brand To snap up
IPZ40N04S5L4R8ATMA1 Infineon Technologies
ESR03EZPJ151 ROHM Semiconductor
TPS63050YFFR Texas Instruments
STM32F429IGT6 STMicroelectronics
BU33JA2MNVX-CTL ROHM Semiconductor
BP3621 ROHM Semiconductor
Hot labels
ROHM
IC
Averlogic
Intel
Samsung
IoT
AI
Sensor
Chip
About us

Qr code of ameya360 official account

Identify TWO-DIMENSIONAL code, you can pay attention to

AMEYA360 weixin Service Account AMEYA360 weixin Service Account
AMEYA360 mall (www.ameya360.com) was launched in 2011. Now there are more than 3,500 high-quality suppliers, including 6 million product model data, and more than 1 million component stocks for purchase. Products cover MCU+ memory + power chip +IGBT+MOS tube + op amp + RF Bluetooth + sensor + resistor capacitance inductor + connector and other fields. main business of platform covers spot sales of electronic components, BOM distribution and product supporting materials, providing one-stop purchasing and sales services for our customers.

Please enter the verification code in the image below:

verification code