曝台积电将会进一步提升车载芯片的价格

Release time：2021-01-26
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source：eefocus
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受到全球范围内缺货潮影响，台积电等芯片代工厂正在衡量进一步提升车载芯片的价格。

 

据悉，台积电汽车芯片子公司先进积体电路（VIS）正在考虑最多达15%的涨价幅度，同时包括联华电子（UMC）在内的代工厂也在衡量类似的涨价事宜。若涨价协商最终落地，这将是自去年秋季以来的第二轮涨价，足以显示市场的紧张供需关系导致生产厂商掌握了主动权。报道称潜在的涨价最早将在二月下旬逐渐落地，并持续至三月。

 

在上一轮涨价中，有报道称代工厂价格提升约10-15%以应对汽车制造商提高产量的需求而追加订单。UMC首席财务官Liu Chi-tung接受媒体采访时表示“无法回答有关价格的问题”，但他也坦言，由于供需平衡关系，现在芯片制造商处于相对有利的地位。

 

从早些时候的市场动向来看，芯片代工厂与汽车芯片客户可能早已就涨价事宜进行接触。包括恩智浦半导体、瑞萨电子等公司已经要求汽车厂商支付更高的价格。如果后续涨价事宜落地，将会进一步挤占汽车厂商的利润率。

 

在被问及预期芯片短缺何时能缓解时，Liu Chi-tung表示联电的工厂目前正处于满载运行，短期内很难增加产能。很难讲整个行业的产能短缺何时能缓解，但对于联电而言至少还需要六个月的时间让产线准备好。

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