Renesas Electronics RA8M1 Arm® Cortex®-M85 Microcontrollers
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Renesas Electronics RA8M1 Arm® Cortex®-M85 Microcontrollers

　　Renesas Electronics RA8M1 Arm® Cortex®-M85 Microcontrollers (MCUs) are a high-performance MCUs based on the Arm® Cortex®-M85 core with Helium for compute-intensive DSP and AI/ML tasks. Leading performance of 480MHz with up to 2MB code flash memory, 1MB SRAM, and advanced peripherals that support a broad range of IoT applications. Octal SPI interface with decryption-on-the-fly for highly secure interface to external memory. High integration with 16-bit CEU camera interface, 12-bit A/D converter, 12-bit D/A converter, PWM timers, High-Speed Analog Comparators, Ethernet MAC with DMA, CAN-FD, USB HS/FS, SCI, SPI, I2C/I3C and safety features. Advanced security with TrustZone®, next-gen cryptography, immutable storage for FSBL, secure boot and tamper protection, including DPA/SPA side-channel attack protection.      The Renesas Electronics RA8M1 is built on a highly efficient 40nm process and supports a wide operating voltage range of 1.68V-3.6V. To ease application development, the RA8M1 is supported by the Flexible Software package (FSP), evaluation kits, software development tools, and Cloud solutions.      FEATURES　　》480MHz Arm Cortex-M85 core with Helium　　*M-Profile vector extension for AI/ML　　*High-performance core featuring Armv8.1m architecture with Helium for DSP/ML acceleration　　*Up to 2MB Flash memory and 1MB SRAM included TCM; 384KB user SRAM and 128KB TCM are ECC-protected　　*32KB I/D caches (ECC protected), 12KB data Flash　　*Advanced security with TrustZone, RSIP Cryptographic engine, immutable storage, and tamper protection　　*Scalable from 100-pin to 224-pin packages　　*Octal SPI interface with decryption-on-the-fly, Ethernet MAC with DMA, CAN-FD, and USB HS/FS (host and device) connectivity options　　*CEU Camera i/f, 12-bit ADCs, 12-bit DACs, high-speed analog comparators, and 3x sample and hold circuits　　*SCI (UART, simple SPI, simple I2C), SPI, I2C, I3C　　*High-performance MCUs @ 480MHz for a broad base of compute-intensive IoT applications　　*High integration for lower costs and simplified design　　*Octal SPI interface with a secure interface to external memory for storage of code and data　　*Advanced security for highly secure IoT　　*Open Arm Ecosystem, easy-to-use Flexible Software Package and comprehensive solutions to enable fast development　　*S/H enable motor control applications　　APPLICATIONS　　*Broad-based IoT applications　　*Industrial automation　　*IoT gateways/hubs　　*Smart home/home automation products　　*Thermostats　　*Home appliances (refrigerators, ovens, washing machines, etc.)　　*Security cameras　　*Building automation (HVAC, access)
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Release time：2023-11-27 14:40 reading：1853 Continue reading>>
Tech Giants Launch AI Arms Race, Aiming to Spark a Wave of Smartphone and Computer Upgrades
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Tech Giants Launch AI Arms Race, Aiming to Spark a Wave of Smartphone and Computer Upgrades

　　According to CNA’s news, the potential business opportunities in artificial intelligence have spurred major tech giants, with NVIDIA, AMD, Intel, MediaTek, and Qualcomm sequentially launching products featuring the latest AI capabilities.　　This AI arms race has expanded its battleground from servers to smartphones and laptops, as companies hope that the infusion of AI will inject vitality into mature markets.　　Generative AI is experiencing robust development, with MediaTek considering this year as the “Generative AI Year.” They anticipate a potential paradigm shift in the IC design industry, contributing to increased productivity and significantly impacting IC products.　　This not only brings forth new applications but also propels the demand for new algorithms and computational processors.　　MediaTek and Qualcomm recently introduced their flagship 5G generative AI mobile chips, the Dimensity 9300 and Snapdragon 8 Gen 3, respectively. The Dimensity 9300, integrated with the built-in APU 790, enables faster and more secure edge AI computing, capable of generating images within 1 second.　　MediaTek points out that the smartphone industry is experiencing a gradual growth slowdown, and generative AI is expected to provide new services, potentially stimulating a new wave of consumer demand growth. Smartphones equipped with the Dimensity 9300 and Snapdragon 8 Gen 3 are set to be released gradually by the end of this year.　　Targeting the AI personal computer (PC) market, Intel is set to launch the Meteor Lake processor on December 14. Two major computer brands, Acer and ASUS, are both customers for Intel’s AI PC.　　High-speed transmission interface chip manufacturer Parade and network communication chip manufacturer Realtek are optimistic. The integration of AI features into personal computers and laptops is expected to stimulate demand for upgrades, leading to a potential increase in PC shipments next year.　　In TrendForces’ report on November 8th, it has indicated that the emerging market for AI PCs does not have a clear definition at present, but due to the high costs of upgrading both software and hardware associated with AI PCs, early development will be focused on high-end business users and content creators.　　For consumers, current PCs offer a range of cloud AI applications sufficient for daily life and entertainment needs. However, without the emergence of a groundbreaking AI application in the short term to significantly enhance the AI experience, it will be challenging to rapidly boost the adoption of consumer AI PCs.　　For the average consumer, with disposable income becoming increasingly tight, the prospect of purchasing an expensive, non-essential computer is likely wishful thinking on the part of suppliers. Nevertheless, looking to the long term, the potential development of more diverse AI tools—along with a price reduction—may still lead to a higher adoption rate of consumer AI PCs.　　Read more　　Key Development Period for AI PCs in 2024; Global Notebook Market Set to Rebound to Healthy Supply-Demand Cycle with an Estimated Growth Rate of 3.2%, Says TrendForce。
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Release time：2023-11-21 10:41 reading：415 Continue reading>>
Can Smartphone Brands Succeed as They Swarm into In-House Chip Development?
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Can Smartphone Brands Succeed as They Swarm into In-House Chip Development?

　　As the global semiconductor supply chain based on specialization, the design and development of Application Processors (AP) or System on Chip (SoC) for smartphones primarily fall under the responsibility of IC design houses. In the wake of Apple’s notable success in pioneering in-house chips, other smartphone companies are now emulating this trend.　　Developing in-house chips poses a challenge for smartphone brands, involving not only significant initial investments but also the navigation of various modules and architectures on the smartphone’s SoCs, including ISP and Modem. Balancing performance and power consumption optimally in specific application scenarios tests the R&D skills of designers, presenting a particularly challenging task for brands lacking relevant technological expertise. However, fueled by the ambition to “product differentiation” and “have a say in the market,” smartphone brands remain enthusiastic about venturing into in-house chips.　　Smartphone Brands and SoC Dilemma　　In current specialization, smartphone brands typically purchase SoC chips from IC design companies like Qualcomm or MediaTek. While they can fine-tune chip performance to suit the brand’s needs after purchase, the room for modification is quite limited.　　Currently, smartphone product development is reaching maturity, and the market lacks innovation. For consumers, in the intensely competitive landscape, smartphones equipped with similar-level SoCs from Qualcomm may only differ in terms of “pricing” as a determining factor for purchase. If the market shifts into a price competition, it becomes unprofitable for smartphone brands.　　Moreover, without the ability to develop in-house SoC, smartphone brands become dependent on IC design companies. If IC design companies alter their fee structures or take measures such as raising prices or adding licensing fees, brands have little choice but to comply, significantly impacting their profits.　　As the central component of smartphones, if brands can design everything from scratch, it enables them to create product differentiation and gain a competitive edge. Although the initial investment is substantial, in the long run, it allows smartphone brands to have a say in the market.　　Apple’s in-house SoC chip has become a significant standard for other smartphone brands in shaping their strategies. Examining Apple’s development trends, the success of the iPhone is largely attributed to Apple’s creation of powerful and efficient SoC chips.　　Apple’s decision not to rely on IC design companies but to design chips in-house allowed iPhone to surpass other competing smartphone products. The key lies in Apple’s ability to plan for hardware and software from the ground up through its self-designed SoC architecture, achieving a high level of product differentiation. In addition to creating the most suitable SoC for the iPhone, it also solidifies a unique competitive advantage for Apple.　　The Costly Pursuit on SoC　　However, venturing into in-house chips poses formidable challenges for smartphone brands. The primary hurdle lies in the necessity for a substantial financial investment. According to statistics from The New York Times, Apple invested about US$10 billion in developing the A4 chip, while Apple’s revenue at that time was approximately US$65 billion. At that time, the smartphone market was not saturated at that time and was still in the development stage, providing ample room for Apple’s growth.　　Focus on the data, from 2010 to 2011, Apple’s revenue generated from selling iPhones grew from about US$25.2 billion to approximately US$45.9 billion, with a growth rate of about 82%. Apple’s revenue scale surpassed US$100 billion in 2012. With a huge and sufficient revenue scale support and the market still having growth potential, although self-developing chips require a large amount of investment, it is indeed feasible for Apple, whose iPhone business is thriving.　　In the current mature and competitive smartphone market, creating product differentiation is the only way to break through. As most Chinese smartphone brands lack the technology to develop SoC, it becomes trending to adopt new strategy of developing in-house chips. Apart from self-developing SoC, some brands also choose to enter from the “specific function chip” on the smartphone.　　Next Challenges in Plateauing Market　　However, compared to the smartphone market situation when Apple initially turned to in-house SoC, current market has entered a plateau phase from the previous golden growth period. Brands find it difficult to generate sufficient revenue scale to support the high cost of in-house chips in the saturated and competitive market.　　Moreover, with the continuous advancement of semiconductor process technology, the current cost to enter is much higher comparing to the past. Even with funds. Achieving in-house SoC involves a significant technical threshold, and it is challenging to bypass patents, especially when competitors have accumulated decades of experience.　　Therefore, while the strategy of brands choosing to self-develop chips is likely to impact IC design companies like Qualcomm and MediaTek, its effects are expected to be limited. The reason is that for IC design companies like MediaTek and Qualcomm, they already occupy a place in the market with exclusive key technologies and accumulated intellectual property rights (IP), making it challenging for smartphone brands’ in-house chips to completely replace MediaTek and Qualcomm products.
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Release time：2023-11-13 15:51 reading：1692 Continue reading>>
Qualcomm and Other Major Players Unveil New Arm-Based Processors, Targeting a Slice of the PC CPU Market
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Qualcomm and Other Major Players Unveil New Arm-Based Processors, Targeting a Slice of the PC CPU Market

　　During the Snapdragon Summit 2023 in October, Qualcomm made a big announcement by introducing the Snapdragon X Elite chip, built on TSMC’s cutting-edge 4nm process. Qualcomm’s claim is bold; they assert that the chip will deliver superior performance compared to Intel’s x86 architecture and Apple’s M2 chip. Simultaneously, towards the end of October, Apple revealed its own Arm-based M3 chip. Notably, semiconductor giants AMD and NVIDIA are rumored to be exploring the development of new PC processors on the Arm architecture. The future outlook suggests that Arm-based processors may gradually cut in the market share traditionally held by x86 architecture processors.　　TrendForce’s Insights:　　Qualcomm’s New PC Processor Poised to Expand the Arm-Based PC Processor Market　　Following Intel’s September 2023 Meteor Lake processor release, Qualcomm introduced the Snapdragon X Elite, its latest Arm-based PC processor in October. This chip leverages TSMC’s advanced 4nm technology. Qualcomm is forging partnerships with Taiwanese heavyweights such as Quanta, Compal, Wistron, Acer, Asus, Realtek, Nuvoton and others, aiming to secure a foothold in the CPU market within the PC supply chain. This collaborative effort is expected to yield new PC products hitting the market in 2024.　　As of 2023, Arm commands approximately 11% of the market share. Apple, a pioneer in PC chips built on the Arm architecture, has seen success with the release of three generations of processors since the 2020 debut of M1 chip.　　With Qualcomm entering the Arm architecture group, AMD also intends to step into Arm architecture with the upcoming Phoenix processor, set for launch in 2025. There are also whispers of NVIDIA partnering with MediaTek to develop a chip processor featuring SoC+GPU capabilities on the Arm architecture, with an initial focus on ChromeBook market, where MediaTek boasts years of experience.　　In the PC market, significant factors include processor development timelines, product performance, power efficiency, extended battery life, and compatibility with software and hardware. High-end CPUs and GPUs have become indispensable components for high-end computers. Currently, Intel leads the CPU market, with AMD following closely in the x86 landscape. As more companies delve into the development of Arm-based processors, there is potential for them to carve a share from the x86 market in the future.　　Arm Architecture Processors Gain Momentum, Intel Focusing on AI Software Application Processor Development　　Apple’s M-series chips demonstrate their efficiency and extended battery life. Microsoft recognizes the advantages of the Arm architecture and is dedicated to fostering a strategic collaboration for Windows on Arm. This collaboration involves integrating operating systems with processors to attract leading manufacturers to engage in Arm-based processor development, aligning with the growing demands for AI PCs.　　In the realm of x86 architecture, Intel enjoys a dominant position in the CPU market. To tap into the opportunities arising from AI PCs, Intel has integrated AI acceleration engine features into its processors, introducing a new generation of AI application processors that combine CPU, GPU, and NPU (Neural Processing Unit) functionalities. This caters to the growing demand for generative AI applications in enterprise mobile PCs. Furthermore, Intel has joined forces with major laptop brands to launch new AI PCs, aiming to seize a substantial share of the market.　　As momentum grows in Arm-based processor development, Intel maintains confidence that their immediate effect on the demand for x86 architecture processors will be restrained. It is unlikely to hinder Intel’s continuous advancement in developing new processors. Unlike competitors concentrating on Arm architecture processor development, Intel places a stronger focus on AI software applications and the market opportunities arising from its partnership with the Microsoft platform.
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Release time：2023-11-07 14:45 reading：2308 Continue reading>>
GigaDevice Launches the GD32H7 Arm® Cortex®-M7 MCU Product Family
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GigaDevice Launches the GD32H7 Arm® Cortex®-M7 MCU Product Family

　　The GD32H7 series offers superior processing power with power efficiency, rich connectivity, and comprehensive security functions. The GD32H7 MCU portfolio consists of 27-part numbers in three series, available in five package types: BGA176, LQFP176, LQFP144, BGA100, and LQFP100. The product samples and development tools will be gradually introduced starting June 2023, with mass production targeted in Q4 2023.　　With an advanced manufacturing process, attractive cost, and outstanding application potential, the GD32H7 MCU series is ideal for signal processing, high-accuracy motor control, digital power supplies, energy storage, audio/voice recognition, and graphic/image applications. Thanks to its ultra-high CPU core clock speed and large memory size, the product also supports applications requiring intensive processing capabilities, such as machine learning (ML) and artificial intelligence (AI).　　"The popularization of connected devices and AI algorithms are driving more intelligence into embedded designs," said Eric Jin, GigaDevice's Product Marketing Director. "The GD32H7 MCU series breaks through the traditional performance boundary of general purpose MCUs, providing superior processing power to enable innovative applications such as complex computation, multimedia processing, edge computing, and ML/AI algorithms. It further enhances the ultra-high-performance product portfolio of GD32 MCUs. With GigaDevice's robust supply chain and high-quality assurance, the GD32H7 is the right product platform for developers to better cope with future application challenges."　　Powerful On-chip Integration　　The GD32H7 MCU series adopts an Arm® Cortex®-M7 high-performance core based on Armv7E-M architecture, with up to 600MHz clock frequency. Its performance is further enhanced by the high bandwidth AXI + AHB bus and the six-stage pipeline architecture with branch prediction capability. The integrated advanced Digital Signal Processing (DSP) hardware accelerator and double-precision Floating-Point Unit (FPU), as well as the hardware Trigonometric Mathematic Unit (TMU) and Filter ACcelerator (FAC), significantly reduce the CPU loading and increase its processing efficiency. The GD32H7 MCU series can operate up to 1552 DMIPS at its highest frequency, and achieve an outstanding performance of 2888 points in CoreMark® benchmark tests, improving code execution efficiency by approximately 10% compared to similar products in the market running at the same frequency. The product’s performance is more than 40% higher than that of Cortex®-M4 products.　　The integrated memories on GD32H7 MCU series are 1024 KB to 3840 KB Flash and 1024 KB SRAM, including 512 KB of configurable Tightly Coupled Memory (TCM) for zero-wait state execution of critical instructions and data. The 64KB high-speed L1-Cache (I-Cache, D-Cache) further increases CPU processing efficiency and real-time performance. Its EXternal Memory Controller (EXMC) enables access to various external memory types such as SDRAM, SRAM, ROM, NOR Flash, and NAND Flash. The built-in Embedded Trace Macrocell (ETM) can trace instructions and data in real time, providing advanced debug functions without interfering with normal CPU operations. The GD32H7 MCU series internal large memory space can support rich operating systems, embedded ML /AI, and other advanced algorithms, thus enabling high-performance and low-latency real-time control.　　Significantly Expanded System Resources　　The GD32H7 MCU series integrates various peripherals, including 8 U(S)ARTs, 4 I2Cs, 6 SPIs, 4 I2Ss, 2 SDIOs, and 2 Octal SPI (OSPI, backward compatible with QSPI) with real-time decryption supported by Real-Time Detection (RTDEC) module. The GD32H7 has 2 USB2.0 OTG interfaces, supporting Full-Speed and High-Speed operation modes. It also integrates 3 CAN-FD modules and 2 Ethernet interfaces to meet the demand for high-speed communication.　　The GD32H7 MCU series provides excellent graphics display and audio/video connectivity solutions. It has a TFT-LCD controller and an Image Processing Accelerator (IPA) for 2D image processing operations such as overlay, rotation, zoom in/out, and conversion among multiple color modes. The product also integrates a Serial Audio Interface (SAI), a SPDIF audio interface, and an 8-bit to 14-bit digital camera interface for video and image capture and transmission.　　The GD32H7 MCU series adopts the supply voltage range from 1.71V to 3.6V DC, with its advanced power management capability. It has three power supply modes (LDO/SMPS/direct power supply) and five low-power modes for a flexible power supply scheme with balanced system power consumption. The GD32H7 MCU has four general-purpose 32-bit timers, twelve general-purpose 16-bit timers, four basic 64-bit/32-bit timers, and two PWM advanced timers, which demonstrate more quantities and higher resolution than competition products, providing the designers more choices with accuracy. The sample rate of two internal 14-bit ADCs can reach 4MSPS, and the 12-bit ADC sampling rate goes up to 5.3MSPS. It also integrates a fast comparator, DAC, and other high-precision analog peripherals to support types of motor control applications.　　The GD32H7 MCU series supports various security functions. It has built-in hardware encryption of DES, 3DES, or AES algorithms and hash algorithms for different security applications to ensure data integrity and protect the transmitted information. The GD32H7 MCU series' SRAM supports ECC verification, effectively enhancing system reliability. The integrated RTDEC module can decrypt the data on AXI or AHB bus in real-time for the confidentiality of read-only firmware stored in external SPI NOR Flash memories.　　The GD32H7 product family is compatible with existing GD32 MCU products, and it offers three product types with different system resources configuration: the GD32H737 product type supports three channels of CAN 2.0B, while the GD32H757 and GD32H759 support three channels of high-speed CAN-FD. From the packaging point of view, GD32H757 is offered in BGA100 and LQFP144/100 package options, while GD32H759 is available in BGA176 and LQFP176 packages.　　The GD32 development ecosystem is now gaining further ground. GigaDevice provides a free development environment for the new GD32H7 MCU series, the GD32 Eclipse IDE, and the GD32 All-In-One Programmer. The product supports direct programming with GD-LINK's SWD/JTAG mode or via the host's UART, USB, and I2C interfaces. Other popular embedded tools such as Arm® KEIL, IAR, and SEGGER will also provide comprehensive support on GD32H7 MCUs, including their integrated development environment (IDE) and debug or trace functions. GigaDevice will also partner with mainstream real-time operating systems (RTOS), middleware such as graphical user interfaces (GUI), and embedded AI algorithms to accelerate the customer project design with a short time-to-market.　　GigaDevice showcased its latest GD32H759l-EVAL full-function development board earlier this year at Embedded World 2023 in Nuremberg, Germany. Other planned starter kits include the GD32H759I-START, GD32H757Z-START, GD32H757J-START, and the GD32H757V-START, and will be available with different package types, enabling designers’ faster application development and debugging. The above development tools will be released to all public distribution channels. Please contact local GigaDevice sales office or authorized representative for more details.
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Release time：2023-08-30 11:42 reading：3507 Continue reading>>
Renesas RZ/G2M Awarded Arm SystemReady IR 1.1 Certification
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Renesas RZ/G2M Awarded Arm SystemReady IR 1.1 Certification

　　Renesas are excited to announce the RZ/G2M-HiHope Reference Board has recently been certified by Arm as a SystemReady IR compliant platform.　　What Is Arm System Ready IR?　　Arm SystemReady is a set of standards and a compliance certification program that enable interoperability with generic, off-the-shelf operating systems and hypervisors, so that software “just works”. SystemReady comes in a number of domain specific ‘flavors’. The IR variant achieved by the RZ/G2M, verifies it as a futureproof solution for Embedded IoT and Edge sector devices, ensuring true interoperability with embedded Linux and other embedded operating systems, and fast-tracking customer development.　　Published details of the Renesas RZ/G2M SystemReady Certification may be found here SystemReady IR – Arm®　　SystemReady IR for Renesas RZ/G2M　　This SystemReady IR certification completion for Renesas Industrial focused RZ devices, demonstrates a commitment by Renesas to provide software solutions that allow developers to focus on making their products innovative, by reducing the investment needed to bring up a platform ready for Linux. This certification marks the first of many Renesas platforms destined for compliance with the Arm program.　　Most embedded software tends to be highly customized. The underlying software and OS are dedicated to a particular platform, and there may often be significant overhead required to make small changes for fixes and/or improvements, or to reflect changes in the underlying hardware. By adapting the existing Renesas RZ software package components to support mandatory open standard interfaces and features, the comprehensive compliance test suite from Arm can ultimately be executed with zero failures. The subsequent clean booting of at least 2 standard OS distribution images “out of the box” confirm the platform’s full compliance.　　The RZ/G2M has been verified with Standard Linux distributions from Debian and OpenSUSE, with support for other distributions in the pipeline. By ensuring compatibility and interoperability with the ecosystem, this removes the early end user effort needed to be ready to develop their differentiating software layers on Linux. In addition, it brings with it the further benefits of forming one of the 3 key building blocks of Arm’s Project Cassini, combining with reference applications, and security certification to enable seamless cloud-native deployments to the RZ/G2M.　　The Arm SystemReady IR certification of the Renesas RZ/G2M demonstrates a future-focused commitment by Renesas to provide systems that “just work” with the Linux ecosystem, operating systems (OS) and software stacks. In addition, verifying platform requirements for long-term software support and maintenance, ensure that the platform can receive regular updates, bug fixes, and security patches. This ensures that developers have continuous access to a stable and reliable software system.　　In short the compliance program helps address both the functionality and increasing complexity, and the real-world concerns in developing platforms with cloud connectivity.　　Renesas RZ/G2M Reference Platform　　The HiHope RZ/G2M (hihope-rzg2m) is manufactured by Jiangsu HopeRun Software Co., Ltd. and uses the Renesas RZ/G2M SoC. More information about the platform can be found on the HiHope RZ/G2M product page.　　The HiHope RZ/G2M platform consists of three parts:　　1) Renesas RZ/G2M (r8a774a1) SoC　　2) HopeRun HiHope RZ/G2M platform　　3) HopeRun expansion board for HiHope RZ/G2 platforms (optional)　　Image
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Release time：2023-08-28 15:38 reading：2902 Continue reading>>
AMEYA360:Experts Weigh Impact of Intel-Arm Collaboration
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AMEYA360:Experts Weigh Impact of Intel-Arm Collaboration

　　Intel Foundry Services and Arm agreed last month to optimize Arm’s IP for Intel’s upcoming 18A process technology (1.8 nm). The collaboration will focus on mobile designs and will undertake design technology co-optimization (DTCO) and system technology co-optimization (STCO), which means that Arm’s IP will be optimized both for Intel’s forthcoming production node and for the company’s advanced packaging technologies.　　Intel Foundry Services and Arm will jointly fine-tune Arm’s IP using the DTCO methodology for Intel’s 18A manufacturing process to optimize performance, power and costs of upcoming designs. One of the key fruits of this collaboration will be development of “an Arm-based mobile SoC and silicon technology demonstration and reference platform for chip designs,” which is a rather broad definition of the work.　　Meanwhile, Intel and Arm confirm that the work has commenced.　　“The work will validate the performance, power and area utilization of Arm SoC designs on the Intel 18A process,” a spokesperson for Intel told EE Times.　　“We are building custom IP to ensure optimal power, performance and area for Arm-based SoC design,” a spokesperson for Arm explained to EE Times. “With this announcement, we enable one more option to our licensees to choose from when they target advanced nodes for Arm-based SoC design.”
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Release time：2023-05-16 10:53 reading：3849 Continue reading>>
AMEYA360:Arm’s Gambit Could Rattle Relationships
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AMEYA360:Arm’s Gambit Could Rattle Relationships

　　In anticipation of one of the biggest IPOs of the year, Arm is changing its licensing model and developing its own mobile processors — moves that are being contested by some of its biggest customers and device makers and will dramatically shift market dynamics and the supply chain.Arm’s Gambit Could Rattle Relationships.　　Almost all smartphone and tablet vendors currently use Arm-based processors for their devices, purchasing them from Qualcomm, MediaTek, Samsung, and HiSilicon. Currently Arm collects a licensing fee for each chip manufactured.　　Instead of licensing its technology to semiconductor companies such as Qualcomm and MediaTek, collecting around 1 percent to 2 percent of the chips’ selling price, Arm wants to collect a percentage of the devices’ average retail value. According to some sources, Softbank and Arm are trying to collect a substantial share of the revenues of mobile device vendors.　　Arm’s clout in the mobile market is considerable. Last month, Arm’s owner Softbank released its 2023 financial report highlighting the increase of Arm’s technology adoption across the entire computing ecosystem, including mobile, gaming, automotive, and billions of microcontrollers.　　At the same time, Softbank’s financial report acknowledged that a principal risk to Arm’s business was the “significant concentration” in its customer base. In 2022, 86 percent of its revenue came from the company’s 20 biggest customers, so “the loss of a small number of key customers could significantly impact the group’s growth.”
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Release time：2023-04-25 11:22 reading：1822 Continue reading>>
AMEYA360：GigoDevice launched Arm Cortex-M4 GD32F4
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AMEYA360：GigoDevice launched Arm Cortex-M4 GD32F4

　　The GD32F4 product series closely aligns with the high-end market requirements and strengthens a greater leading advantage in the market with its features of high performance, tight real-time, and large capacity.　　The GD32F4 series MCU powered by the Arm? Cortex?-M4 core with a processor frequency of up to 240 MHz makes it suitable for embedded applications using higher complex algorithms. It has the advantages of faster real-time processing capability and industry-leading large-capacity storage.　　The GD32F4 series offers rich peripheral resources, including up to four USARTs and four UARTs, three I2Cs, six SPIs, two I2S, two CAN 2.0B, one SDIO port, one 10/100M Ethernet controller, as well as USB 2.0 FS and HS communications. It also comes with three 12-bit high-speed ADCs and two 12-bit DACs with a sampling rate of up to 2.6MSPS　　In addition, the GD32F4 product series integrates a TFT LCD controller and a hardware Image Processing Accelerator (IPA) for LCD driving and a significant enhancement of display image quality. It supports an 8-bit to 14-bit camera video interface for easy connection to digital cameras and implementing image acquisition and transmission.　　The GD32F470/F427/F425 series products, fully compatible with GD32F450/F407/F405 series, are widely used in many innovative fields such as advanced computing, cloud servers, AI, industrial control, motor invertor, graphics display, security surveillance, sensor network, drones, robots, IoT, and more.　　Features　　Series  GD32F470　　Package  BGA176　　Max Speed (MHz)  240　　Flash (Bytes)  3072K　　SRAM (Bytes)　256K　　I/O　　up to 140　　GPTM (32bit)　　2　　GPTM (16bit)　　8　　Advanced TM (16bit)　　2　　Basic TM (16bit)　　2　　WDG　　2　　RTC　　1　　USART+UART　　4+4　　I2C　　3　　SPI　　6　　CAN 2.0B　　2　　USB 2.0　　FS_OTG+HS_OTG　　I2S　　2　　SDIO　　1　　LCD-TFT　　1　　Camera　　1　　ETH MAC　　1　　IPA　1　　EXMC/SDRAM　　1/1　　12bit ADC Units (CHs)　　3(24)　　12bit DAC Units　　2
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Release time：2023-03-29 11:14 reading：1640 Continue reading>>
AMEYA360:Renesas Entry-Line 200MHz Arm® Cortex®-M33 General Purpose Microcontroller RA6E2
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AMEYA360:Renesas Entry-Line 200MHz Arm® Cortex®-M33 General Purpose Microcontroller RA6E2

　　The RA6E2 entry-line microcontroller is based on the 200 MHz Arm Cortex-M33 core with TrustZone.　　RA6E2 MCUs offer best-in-class performance as an entry-line microcontroller while pursuing cost optimization. Pin and peripheral compatibility with the RA4E2 group make it ideal for applications requiring higher performance, small footprint, and lower pin counts.　　Features:　　200MHz Arm Cortex-M33 with TrustZone　　128KB - 256KB Flash memory and 40KB SRAM　　4KB Data Flash to store data as in EEPROM　　1KB Standby SRAM　　Scalable from 32-pin to 64-pin packages　　USB 2.0 Full Speed　　CAN FD, I3C　　HDMI CEC, SSI　　Quad SPI　　12-bit A/D Converter　　12-bit D/A Converter　　General PWM Timer　　Applications:　　Add-On Voice User Interface (VUI) Solution　　General purpose　　Sensor applications (Medical, Industrial, Wearable)　　Communication/Network module　　Home appliances　　Fingerprint reader module　　Home entertainment (Voice command/recognition)
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Release time：2023-03-24 11:48 reading：3469 Continue reading>>

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ESR03EZPJ151 ROHM Semiconductor
STM32F429IGT6 STMicroelectronics
IPZ40N04S5L4R8ATMA1 Infineon Technologies
TPS63050YFFR Texas Instruments
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Qr code of ameya360 official account

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AMEYA360 mall (www.ameya360.com) was launched in 2011. Now there are more than 3,500 high-quality suppliers, including 6 million product model data, and more than 1 million component stocks for purchase. Products cover MCU+ memory + power chip +IGBT+MOS tube + op amp + RF Bluetooth + sensor + resistor capacitance inductor + connector and other fields. main business of platform covers spot sales of electronic components, BOM distribution and product supporting materials, providing one-stop purchasing and sales services for our customers.

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