Jiangsu Abest, originally under the Taiwan-based Zhefu Group, has now transitioned its team to Kunshan Abest.The company possesses comprehensive in-house capabilities spanning independent chip design, process development (wafer process development and component design), testing, packaging, and a reliability laboratory. This establishes a fully integrated optocoupler design and production system (with only wafer processing outsourced). It stands as the only team in Greater China, and one of the few globally, with such complete optocoupler technology expertise.In collaboration with wafer foundries, Jiangsu Abest has developed a BCD optocoupler process, enabling the design of the world's smallest and most cost-effective high-end optocouplers.Jiangsu Abest exclusively employs red light LEDs, avoiding the light decay issues associated with IR LEDs. The proprietary insulating light-transmitting material, combined with a stacked optocoupler packaging patent, results in higher light efficiency, lower power consumption, enhanced energy savings, a more compact form factor, stronger integration capabilities, and greater future potential.The redesigned low-end optocouplers (through adjusted processes and component architecture) also lead the global market. The product portfolio includes high-speed photo transistors, photo triacs resistant to high switching transient voltage (dV/dt), and automotive-grade photo relays featuring high-temperature operation and low power consumption.The team brings over 30 years of experience in IC design and advanced semiconductor process technology.Unlike many domestic manufacturers who purchase chips for packaging and processing, Jiangsu Abest ability to independently design integrated circuit chips results in lower costs and more distinctive products.The patented stacked die packaging technology enhances photoelectric conversion efficiency, enables lower starting current, improves energy efficiency, allows for thinner profiles, increases speed, reduces costs, and extends product lifespan.The capability to develop proprietary wafer processes allows products to be faster, more robust, and more distinctive.Jiangsu Abest boasts a strong applications team capable of developing chips better suited for system requirements from the system application perspective.Due to the stacked packaging technology, light is confined to the sensing area, preventing interference with other circuits. This makes system circuit integration feasible, aligning with the demands for system integration and miniaturization, and offering greater future potential.Jiangsu Abest is progressively transferring wafer process technology to achieve the goal of complete technological independence in chip design, wafer processing, and packaging & testing within China.