华大半导体车规级驱动产品HSA6880-Q获奖创新奖

Release time:2023-02-24
author:Ameya360
source:网络
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  近期,中国集成电路创新联盟(大联盟)发布了第六届集成电路产业技术创新奖(简称“IC创新奖”)的评审结果,华大半导体凭借自主研发的车规级带完整保护功能的隔离驱动产品HSA6880-Q,荣获第六届“IC创新奖”——“成果产业化奖”奖项。

华大半导体车规级驱动产品HSA6880-Q获奖创新奖

  HSA6880-Q采用磁隔离技术,带有完整的保护功能,可靠性等级达到车规AEC-Q100 Grade1标准,是该领域国内最早一批实现批量量产的产品,填补了国内空白。目前该产品已经在新能源汽车主驱电控系统标杆客户大批量装机应用。凭借优秀的品质表现、可靠的供应保障、高效的技术支持,该产品获得广大客户的高度认可。

  关于“IC创新奖”

  “IC创新奖”由大联盟于2018年创立,旨在重点鼓励集成电路技术创新、成果产业化、产业链上下游合作,以体现联盟倡导全产业链合作的理念,是集成电路产业最重要的技术奖项之一。其中技术创新奖项旨在表彰在集成电路重大技术创新和关键技术开发方面取得重大突破的单位和团队。

  第六届IC创新奖的奖项是由本活动特别设立的提名委员会和评审委员会共同参与,经过提名奖项、评审奖项、结果公示和公布奖项等一系列环节评选而出的。其中,提名委员会由来自国内集成电路全产业链各领域的产业技术领军人才、战略科学家以及金融专家等组成,负责对奖项提名。评审委员会由提名委员会、大联盟咨询委专家以及申报项目所属领域范围的顶级权威专家组成,负责对提名项目进行评审。


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